Unlock instant, AI-driven research and patent intelligence for your innovation.

Wafer Test Method

A test method and wafer technology, applied in the direction of single semiconductor device testing, etc., can solve problems such as unqualified die test results, achieve the effects of low cost, simple operation, and improved accuracy

Active Publication Date: 2017-02-22
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Ultimately, the test result of the originally qualified die is unqualified

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Wafer Test Method
  • Wafer Test Method
  • Wafer Test Method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] refer to Figure 4 As shown, the present embodiment provides a method for testing a wafer, including:

[0052] Step S11, attaching the probes to the wafer according to the corresponding relationship between each probe on the probe card and the test solder joints on each die of the wafer;

[0053] Step S12, obtaining the position of each probe on the corresponding die, and measuring the distance between each probe and more than two boundary points in the corresponding test solder joint;

[0054] Step S13, judging whether each of the distances is greater than the first threshold and smaller than the corresponding second threshold, if yes, the probe corresponding to the distance is at the correct position; if not, the probe corresponding to the distance The probe is in the wrong position.

[0055] This embodiment can realize the detection of each probe on the probe card, thereby improving the detection accuracy.

[0056] Firstly, step S11 is executed to provide a probe ...

Embodiment 2

[0078] This embodiment provides a method for testing a wafer. After using the method of Embodiment 1 to determine whether each probe is in the correct position, when a probe is in the wrong position, you can further obtain the probe in the wrong position. For the corresponding offset direction and offset, and count the number of probes in the wrong position.

[0079] When the number is one, calculate whether all probes are in the correct position after the adjustment amount is moved in the direction opposite to the offset direction, and the adjustment amount is greater than the offset amount and smaller than the corresponding second threshold;

[0080] When the probes are all in the correct position, remove the probe card from the wafer, move the probe card to the direction opposite to the offset direction by an adjustment amount, and place the probe card reseated on wafer;

[0081] When there is at least one probe at a wrong position, remove the probe card from the wafer, m...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a testing method of a wafer, comprising the following steps: buckling a probe on a wafer according to the relationship of every probe on a probe card and a testing weld point on every pipe core of the wafer; obtaining the position of every probe on the corresponding pipe core, measuring the distance between every probe and more than two border points in the corresponding testing weld point; when the distance is greater than the first threshold value and less than the corresponding second threshold value, the probe corresponding to the distance is located at the correct position; or, the probe corresponding to the distance is located at the wrong position. The testing method can improve the accuracy of detecting.

Description

technical field [0001] The invention relates to the testing field of semiconductor devices, in particular to a wafer testing method. Background technique [0002] The entire manufacturing process of semiconductor devices can be divided into wafer manufacturing, wafer testing, wafer packaging, and final testing. [0003] The wafer manufacturing refers to manufacturing semiconductor devices on a silicon wafer. After the semiconductor device is manufactured, a plurality of repeated dies will be formed on the silicon wafer. In the wafer testing step, it is necessary to conduct an electrical test on the die to ensure that the die on the silicon wafer is a qualified product before packaging, so wafer testing is one of the key steps to improve the yield of semiconductor devices one. [0004] Generally, the test equipment includes at least one probe, and the probe touches the die on the wafer for electrical testing. Specifically, the die is usually provided with one or more test p...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/26
Inventor 王磊
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP