A heat sink shared by multiple chips and a circuit board provided with the heat sink

Abstract

The embodiment of the invention provides a heat radiator shared by multiple chips and a circuit board provided with the heat radiator. The heat radiator comprises a base plate, wherein the upper surface of the base plate is provided with multiple radiating fins; the lower surface of the base plate is provided with at least one boss mutually contacted with the upper surface of a first chip on the circuit board; and the edge of the base plate is provided with a limiting bracket used for supporting the base plate on the circuit board. The invention further provides a circuit board provided with the heat radiator. The boss is arranged on the base plate of the heat radiator and the limiting bracket is arranged on the base plate, so that the heat radiating area can be expanded to the whole circuit board and can be enlarged, and the heat-radiating capability can be enhanced; and meanwhile, multiple different types of chips can share the heat radiator, so that the stress of the chip is controllable, and the risk that the stress of the chips is overlarge, and the bonding point of the circuit board is subjected to creep deformation is solved.

Description

technical field [0001] The embodiments of the present invention relate to the technical field of communications, and in particular to a heat sink shared by multiple chips and a circuit board provided with the heat sink. Background technique [0002] With the rapid development of science and technology, the capacity of chips and boards in equipment continues to increase, and the power consumption of chips and boards is also increasing. In order to meet the requirement of heat dissipation capability, the radiator area of ​​the single board is also getting larger and larger, which already exceeds 50% of the area of ​​the single board. Even so, it still cannot meet the heat dissipation requirements. [0003] In the prior art, two chips of the same type usually use a common heat sink, wherein the height dimensions and tolerances of the two chips are consistent. figure 1 It is a structural schematic diagram of a heat sink in the prior art. Such as figure 1 As shown, at least a...

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Problems solved by technology

[0004] The above-mentioned existing technology expands the heat dissipation area, but in the process of realizing the embodiment of the present invention, the inventor found that the existing technology can only use a common heat sink for some chips of the same type, so the heat dissipation area is limited and the heat dissipation capacity is limited; It is difficult to share the heat sink between different types of chips. By increasing the thickness of the heat conduction layer to fill the height difference between the chip and the heat sink, there is a risk of uncontrollable force on the chip or creep of the solder joint on the circuit board.

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