UV-LIGA (Ultraviolet-Lithografie, Galvanoformung, Abformung) method for manufacturing multi layers of mini-type inductance coils on silicon substrate

Abstract

The invention discloses a UV-LIGA (Ultraviolet-Lithografie, Galvanoformung, Abformung) method for manufacturing multi layers of mini-type inductance coils on a silicon substrate. The UV-LIGA method integrates an MEMS (Micro Electro Mechanical System), a micro inductance coil of which the cross section diameter is ten micrometers and even several micrometers can be manufactured through a UV-LAIG craft of photoetching, developing, sputtering and electroforming craft and a PECVD (Plasma Enhanced Chemical Vapor Deposition) technology, and the size limit of the traditional manufacturing method of an inductance coil is broken. The UV-LIGA method disclosed by the invention is used for manufacturing a single-layer mini-type coil or multi layers of series-and-parallel communication structure coils, and the filling of insulation layers between the multi layers of the coils can be carried out through the PECVD technology. The bottom layer insulation effect is good as a silicon wafer is used as a substrate, the silicon wafer is light and the thin, and the operation is flexible; and a chromium plate is used as a masking tool, thus the transshipment from a design configuration to a manufacturing shape can be realized, the design for the size, the shape and the distribution of the inductance coil can be very flexible and simple, multiple sets of the inductance coils can be processed at one step according to the distribution of a masking configuration, the performance cost is high, and the processing efficiency and the forming rate are greatly increased.

Description

technical field [0001] The invention belongs to the technical field of inductance coil production, and in particular relates to a UV-LIGA process method for multilayer miniature inductance coils on a silicon substrate. Background technique [0002] At present, the manufacture of the inductance coil is either made by winding the paint leather wire along the insulated solenoid, or by the printed circuit board process. [0003] Helically wound inductance coils have certain disadvantages: for example, it is limited to the production of macroscopic inductance coils with a certain size, and it is powerless to produce microscopic inductance coils with a diameter of less than tens of microns; when the number of turns is large, the stability and mechanical strength of the coil structure are relatively low , prone to loosening, falling off, slipping and other phenomena that will affect the electrical properties of the coil, especially the hollow structure; it needs to be completed by ...

AI Technical Summary

Problems solved by technology

[0003] Helically wound inductance coils have certain disadvantages: for example, it is limited to the production of macroscopic inductance coils with a certain size, and it is powerless to produce microscopic inductance coils with a diameter of less than tens of microns; when the number of turns is large, the stability and mechanical strength of the coil structure are relatively low , prone to loosening, falling off, slipping, etc., which will affect the electrical properties of the coil, especially the hollow structure; it needs to be completed by personnel with certain operating experience

In the currently used technology, the first shortcoming is particularly obvious. At present, the sensor is developing in the direction of micro precision, especially for the production of a micro sensor inductance coil with a diameter of about ten microns. This method cannot be realized at all.

[0004] The printed circuit board process method has some of the above-mentioned shortcomings, and it also has some inconveniences: for example, the circuit design, wiring, and photographic base plate manufacturing cycle are long, and the cost performance is low; After the completion, it is easy to produce many broken films attached to the board and cause disconnection, which affects the performance of the coil; improper operation by the assembly and connection personnel can easily cause circuit damage, and high reliability detection methods are required;

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