Chamber device and substrate-processing device therewith

A substrate processing equipment and chamber technology, applied in gaseous chemical plating, metal material coating process, coating, etc., can solve problems such as complex nozzle structure, chamber damage, complexity, etc., to improve safety and reliability Maintainability, high cooling efficiency, and simple design and processing

Active Publication Date: 2012-10-17
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the complex structure of the nozzle of the intake system, the design of the channel on it is more complicated, and it is not easy to process and realize
Moreover, if water cooling or oil cooling is used, once the cooling water leaks, it will cause great damage to the chamber and it is difficult to maintain

Method used

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  • Chamber device and substrate-processing device therewith
  • Chamber device and substrate-processing device therewith
  • Chamber device and substrate-processing device therewith

Examples

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Embodiment Construction

[0040] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0041] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", " The orientations or positional relationships indicated by "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying Describes, but does not indicate or imply that the device or element referred...

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Abstract

The invention provides a chamber device, which includes: a chamber body, which defines a chamber therein; a first thermoelectric cooling member, a cold end of which is arranged near at least a portion of an outer surface of the chamber body to cool the chamber body; and a hot end of the first thermoelectric cooling member is arranged far from at least a portion of the outer surface of the chamber body. The invention also provides a substrate-processing device having the chamber device. The thermoelectric cooling member is adopted by the invention to cool the chamber body. The chamber device is characterized by simple processing and design, good cooling effects, and improvement in safety and maintainability.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a chamber device and substrate processing equipment with the chamber device. Background technique [0002] CVD (Chemical Vapor Deposition) is a chemical technique used to produce solid materials with high purity and good performance. The CVD manufacturing process is to expose the wafer (substrate) to one or more different precursors, and at a certain process temperature, a chemical reaction and / or chemical decomposition occurs on the surface of the substrate to produce the film to be deposited. Most of the different by-products produced during the reaction will be carried along with the airflow and will not stay in the chamber. [0003] According to different classification methods, CVD can be divided into many types. For example, classified by pressure, CVD includes low-pressure CVD (Low-pressure chemical vapor deposition, LPCVD), atmospheric pressure CVD (Atmospheric p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C16/44C23C16/455
Inventor 徐亚伟
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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