Method and device for dispatching to batch machine

A batch processing and machine technology, applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of reducing production efficiency, increasing semiconductor manufacturing costs, and machines cannot perform batch processing, so as to ensure correctness and Flexibility, the effect of reducing waiting time

Active Publication Date: 2012-11-07
SEMICON MFG INT (SHANGHAI) CORP
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  • Abstract
  • Description
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Problems solved by technology

[0005] In view of this, the technical problem that the present invention solves is: rely on experience to arrange the mode of chip group processing order, the engineer can't determine the shipment of the chip group that can batch process, cause machine platform to be because of lacking the chip group to be processed that can be batch-processed. Unable to perform batch processing, reducing production efficiency and increasing the cost of semiconductor manufacturing

Method used

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  • Method and device for dispatching to batch machine
  • Method and device for dispatching to batch machine

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specific Embodiment 1

[0032] Detailed description below figure 1 Shown is the delivery method of the batch processing machine proposed by the present invention.

[0033] For some machines that perform specific processes, such as machines in the furnace tube area, etching area, and acid bath area, due to the long processing time of the execution process, it is often necessary to batch process the wafer groups to be dispatched to the machine . These machines that perform specific processes are called batch machines. In this embodiment, a Batch machine is taken as an example for description.

[0034] Step 101. For different chip groups, after saving the process flow, the machine information for executing each process, the formula parameters of each process, and the execution status of the current process, set the number of steps (Step Cnt) of the future process (Future flow);

[0035] In this step, the process flows corresponding to different chip groups, the machine information for executing each ...

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Abstract

The invention provides a method and a device for dispatching to a batch machine. The method includes: by comparing the formulation parameter of each chipset in a performing process of a batch machine with the formulation parameter of a to-be-processed chipset of the batch machine, preferentially processing current processes of the chipsets with the same formulation parameter, and dispatching to the batch machine to enable the batch machine to obtain the chipsets as quickly as possible, wherein the chipsets can be batched together with the to-be-processed chipset. Therefore, waiting time for dispatching is shortened, accuracy and flexibility of dispatching are guaranteed, the problem that the batch machine cannot batch due to lacking of dispatching of the chipsets for batching is solved, and production efficiency is improved while cost for manufacturing semiconductors is saved.

Description

technical field [0001] The invention relates to a method and a device for controlling a semiconductor production process, in particular to a method and a device for batch machine delivery. Background technique [0002] At present, in semiconductor manufacturing, a wafer (wafer) has to go through a process flow consisting of hundreds of processes in order to make a final product. Different processes are carried out in different machines, and one or more machines that complete the same process form a machine. Taiwan group. After the wafer completes a current process, it will be dispatched to the machine for the next process for processing according to the process flow. Different products are produced with different process flows. A batch of chips produced with the same process flow is called a chip set (Lot). Each Lot will enter a machine that performs different processes for processing according to its specific process flow. A machine, the Lot to be executed by the machine ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00
Inventor 吕庆麟陈波范安涛钱红兵赵晨
Owner SEMICON MFG INT (SHANGHAI) CORP
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