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Wafer cleaning equipment

A technology for cleaning equipment and wafers, applied in cleaning methods and appliances, electrical components, semiconductor/solid-state device manufacturing, etc., can solve the problems of secondary pollution of wafers, poor cleaning effect, etc., and achieve the goal of avoiding pollution and improving cleanliness Effect

Active Publication Date: 2014-11-26
HWATSING TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Existing wafer cleaning equipment will recontaminate the wafer when cleaning the wafer
Therefore, existing wafer cleaning equipment has the defect of poor cleaning effect

Method used

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  • Wafer cleaning equipment
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Embodiment Construction

[0028] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

[0029] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation or position indicated by "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. The relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the descrip...

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PUM

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Abstract

The invention discloses wafer cleaning equipment which comprises a frame, a wafer cleaning device, a wafer brushing device, a wafer drying device and a manipulator. The wafer cleaning device is arranged on the frame, the wafer brushing device is arranged on the frame and positioned on the lower side of the wafer cleaning device, the wafer drying device is arranged on the frame and positioned on the lower side of the wafer brushing device, and the manipulator is movably arranged on the frame and used for vertically clamping wafers and transporting the wafers. The wafer cleaning equipment in the embodiment has the advantages of effectiveness in cleaning and the like.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a wafer cleaning device. Background technique [0002] After the CMP process, the wafer needs to be cleaned. Existing wafer cleaning equipment will recontaminate the wafer when cleaning the wafer. Therefore, the existing wafer cleaning equipment has the defect of poor cleaning effect. Contents of the invention [0003] The present invention aims at solving one of the above technical problems at least to a certain extent or at least providing a useful commercial choice. Therefore, an object of the present invention is to provide a wafer cleaning device with advantages such as good cleaning effect. [0004] In order to achieve the above purpose, a wafer cleaning device is proposed according to an embodiment of the present invention. The wafer cleaning equipment includes: a frame; a wafer cleaning device, the wafer cleaning device is arranged on the frame, and the wa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67B08B7/04
Inventor 路新春沈攀何永勇
Owner HWATSING TECH