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A testable device kelvin test circuit with added unit test module

A test module and test loop technology, which is applied to electric solid state devices, semiconductor devices, semiconductor/solid state device components, etc., can solve the problems of limited number of test PADs, difficulty in increasing the number of devices, and limited test devices, and achieves a simple structure, The effect of improving the utilization rate and convenient wiring

Active Publication Date: 2015-08-12
SHANGHAI HUALI MICROELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, since a Kelvin test device needs to use 4 test PADs, and the number of test PADs is limited, and in order to cooperate with the probe card (Probe Card), the area of ​​the PAD needs to be designed very large, so within the area of ​​a Test Block Accommodates fairly limited devices for testing
[0004] The Kelvin test circuit generally used now, even if some PADs are shared, it is still difficult to increase the number of devices that can be carried

Method used

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  • A testable device kelvin test circuit with added unit test module
  • A testable device kelvin test circuit with added unit test module
  • A testable device kelvin test circuit with added unit test module

Examples

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Embodiment Construction

[0013] On the premise of not changing the number and area of ​​the test unit (PAD), the invention utilizes the switching effect of CMOS to increase the number of devices that can be tested by a unit Test Block by switching and utilizing the unit (PAD).

[0014] In the following, the circuit provided by the present invention will be further described in detail through the examples, so as to better understand the content of the invention, but the content of the examples does not limit the protection scope of the invention.

[0015] A general Kelvin test loop can carry 10 test devices in one test unit. However, using the design of the present invention can carry 90 Kelvin test devices without changing the number and size of the PAD. Compared with the traditional design, this design scheme can save 8 times the area of ​​the test module, effectively improving the use efficiency of the unit area of ​​the test key.

[0016] The present invention will be described below by taking the...

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PUM

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Abstract

The invention provides a Kelvin test loop capable of increasing testable devices of unit test block. The Kelvin test loop comprises a plurality of unit test modules, a plurality of force PADs, a plurality of gate control PADs, a sense high PAD, a sense low PAD and a grounding PAD, and is characterized in that four ends of each unit test module are respectively connected in series with a CMOS (Complementary Metal Oxide Semiconductor) device to be communicated with the force PAD, the sense high PAD, the sense low PAD and the grounding PAD, the plurality of unit test modules share one sense high PAD, one sense low PAD and one grounding PAD, and the drain electrode ends of the CMOS devices are communicated with the gate control PAD. The Kelvin test loop provided by the invention has a simple structure, facilitates layout wiring, is convenient to implement, improves the utilization ratio of a test area, and has quite practical values on both the WAT test of products in volume production and the development design of trial chips for research and development.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a test model for electrical testing of a semiconductor front-end process, and further provides a testable device Kelvin test circuit with added unit test modules. Background technique [0002] The Kelvin test method is a high-precision electrical test method in the resistance test. It can measure various resistance values ​​very accurately and is rarely affected by the resistance of the wire. [0003] However, since a Kelvin test device needs to use 4 test PADs, and the number of test PADs is limited, and in order to cooperate with the probe card (Probe Card), the area of ​​the PAD needs to be designed very large, so within the area of ​​a Test Block Accommodates quite limited devices for testing. [0004] Now the commonly used Kelvin test circuit, even if some PADs are shared, it is still difficult to increase the number of devices that can be carried. Generally, a 22PA...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/544G01R27/08
Inventor 周羽宇
Owner SHANGHAI HUALI MICROELECTRONICS CORP