Heat radiator

Abstract

A heat radiator comprises a plurality of heat radiation fins. Each heat radiation fin comprises a body. The surface of the body of each heat radiation fin extends to form a folded plate. The folded plate firstly extends towards the body of each heat radiation fin and then is bent backwards the body. The folded plates are abutted with the adjacent bodies of the heat radiation fins to assemble the heat radiation fins, therefore, heat radiation areas of the heat radiation fins can be enlarged, and function of turbulent flow can be realized. Besides, time of air flow staying among the heat radiation fins can be prolonged, so that convection coefficient of the air flow is increased, and heat transfer effect is improved. Further, the heat radiation fins are more compactly combined due to the fact that the folded plates and the heat radiation fins are abutted, and stability of the heat radiator is improved.

Description

technical field [0001] The invention relates to a cooling device, in particular to a cooling device for cooling electronic products. Background technique [0002] As the processing speed and response frequency of integrated circuit components become faster and higher, more and more heat is generated, and excessive temperature will seriously affect the normal operation of integrated circuits, and even damage the electronic components in them. , so a heat sink is required to cool the integrated circuit. A traditional heat dissipation device usually includes several pieces of heat dissipation fins. The heat dissipation fins dissipate the heat generated by the electronic components through the airflow channels formed between the fins. Such as figure 1 As shown, the traditional heat dissipation fin group is formed by interconnecting several single planar fins. However, due to the small area of ​​the fins, the heat dissipation area of ​​the fin group is small, which is not con...

AI Technical Summary

Problems solved by technology

However, due to the small area of ​​the fins, the heat dissipation area of ​​the fin group is small, which is not conducive to exchanging heat with the air

Moreover, there is only one linear airflow channel between every two fins, which will cause the heat exchange time between the airflow and the fins to be short, the heat convection coefficient of the heat sink is small, and the heat transfer effect is not good.

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