Chip sorting device and chip sorting method

Abstract

The invention relates to a chip sorting device and a chip sorting method. Chip sorting time can be shortened and chip sorting accuracy can be improved. The chip sorting device (1) moves LED chips to an arranging work bench (4) through a conveying arm (2) from a supply workbench (3) which is carried with a plurality of LED chips being used as semiconductor chips after a wafer is cut. The length of the conveying arm (2) is at least half of the combined length of a radius of the supply workbench (3) and half of the length of a long edge of the arranging work bench (4). The supply workbench (3) moves along X-Y direction and selects a conveyed LED chip and rotates a regulated angle (90DEG), and thereby a selection area of the conveyed LED chip can be set. The supply workbench (3) and the arranging work bench (4) are respectively provided with a rotation mechanism.

Description

technical field [0001] The present invention relates to a chip sorting device that sequentially moves semiconductor chips onto an alignment table from a supply table on which a plurality of semiconductor chips that have been cut and pasted on an adhesive sheet is mounted, and chip sorting using the chip sorting device method. Background technique [0002] In this conventional chip sorting device, on the XY plane composed of two orthogonal axes, that is, the X axis and the Y axis, the cut wafers are placed on a movable table, and the wafers are cut by a CCD camera fixed on the base. To judge whether the semiconductor chip is qualified or not, the wafer is clamped by a robot or the like, and first, transferred to a fixed position correction table on the base. There are reference pressing parts in two orthogonal directions, and the positioning table fixed to the base mechanically presses and positions the chip in these two directions, and then it is clamped again by another tr...

AI Technical Summary

Problems solved by technology

[0005] As the size of the wafer increases and the size of the supply stage 103 of the target ring increases, the length of the transfer arm 102 of the conventional chip sorting device becomes longer, and the moving distance from the supply stage 103 to the alignment stage 101 becomes larger. Long, so there is a problem that the classification time becomes longer

In addition, similarly to this, since the transfer arm 102 becomes longer, there is a problem that the alignment accuracy on the alignment table 101 also decreases.

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