IC (Integrated Circuit) plastic-package body voltage withstand test clamp and test methods

A technology of withstand voltage test and withstand voltage tester, which is applied in the direction of testing dielectric strength and measuring device casing, etc., which can solve problems such as long cycle time and affecting test production capacity, and achieve the goal of improving production efficiency, increasing test capacity and improving test efficiency Effect
CN102798739AInactive Publication Date: 2012-11-28HANGZHOU SILAN INTEGRATED CIRCUIT
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
HANGZHOU SILAN INTEGRATED CIRCUIT
Publication Date
2012-11-28
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses an IC (Integrated Circuit) plastic-package body voltage withstand test clamp which comprises a fixed base, a pressing plate and a guide pillar, wherein at least one bearing body which is used for placing a whole IC plastic-package body is arranged on the fixed base; the bearing body is internally provided with a plurality of first metal gaskets which are arranged at intervals and electrically connected with the cathode of a voltage withstand tester; a second metal gasket which is connected with the anode of the voltage withstand tester is also arranged on the fixed base; and the pressing plate is arranged on the guide pillar and is capable of moving up and down relative to the guide pillar. The invention discloses two plastic-package body voltage withstand test methods. According to the clamp and the methods, a voltage withstand test can be carried out on the whole IC plastic-package body before products are subjected to trimming and forming, so that the test efficiency is improved and the voltage withstand test can be carried out on a plurality of IC plastic-package bodies at the same time.
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Description

technical field

[0001] The invention relates to the field of semiconductor manufacturing, in particular to a jig and a test method for withstand voltage testing of an IC plastic package. Background technique

[0002] At present, in the electronic component manufacturing industry, the existing withstand voltage test scheme: first cut and shape the entire IC plastic package to form a single IC product; then perform the withstand voltage test. The withstand voltage test is to test whether the plastic-encapsulated product can withstand the required voltage. Among them, IC stands for Integrated Circuit, the meaning of integrated circuit.

[0003] It can be seen that the withstand voltage test of the existing IC plastic package is arranged in the final test process, and the withstand voltage test of a single IC product is carried out. However, the withstand voltage test is for a single IC product, and a single IC product needs to be subjected to a withstand voltage test one by o...

Claims

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