IC (Integrated Circuit) plastic-package body voltage withstand test clamp and test methods

Abstract

The invention discloses an IC (Integrated Circuit) plastic-package body voltage withstand test clamp which comprises a fixed base, a pressing plate and a guide pillar, wherein at least one bearing body which is used for placing a whole IC plastic-package body is arranged on the fixed base; the bearing body is internally provided with a plurality of first metal gaskets which are arranged at intervals and electrically connected with the cathode of a voltage withstand tester; a second metal gasket which is connected with the anode of the voltage withstand tester is also arranged on the fixed base; and the pressing plate is arranged on the guide pillar and is capable of moving up and down relative to the guide pillar. The invention discloses two plastic-package body voltage withstand test methods. According to the clamp and the methods, a voltage withstand test can be carried out on the whole IC plastic-package body before products are subjected to trimming and forming, so that the test efficiency is improved and the voltage withstand test can be carried out on a plurality of IC plastic-package bodies at the same time.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a jig and a test method for withstand voltage testing of an IC plastic package. Background technique [0002] At present, in the electronic component manufacturing industry, the existing withstand voltage test scheme: first cut and shape the entire IC plastic package to form a single IC product; then perform the withstand voltage test. The withstand voltage test is to test whether the plastic-encapsulated product can withstand the required voltage. Among them, IC stands for Integrated Circuit, the meaning of integrated circuit. [0003] It can be seen that the withstand voltage test of the existing IC plastic package is arranged in the final test process, and the withstand voltage test of a single IC product is carried out. However, the withstand voltage test is for a single IC product, and a single IC product needs to be subjected to a withstand voltage test one by o...

AI Technical Summary

Problems solved by technology

However, the withstand voltage test is for a single IC product, and a single IC product needs to be subjected to a withstand voltage test one by one. However, since the withstand voltage test requires a certain boost time, the cycle required to test an IC product is relatively long , so, seriously affect the test capacity

Images