Awakening and hot-plugging methods and equipment based on high speed inter-chip (HSIC)

A high-speed, interface technology between chips, applied in the information field, can solve the problem of high power consumption of equipment, and achieve the effect of saving power and realizing hot swap

Active Publication Date: 2012-11-28
HUAWEI DEVICE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the prior art, the host chip and the peripheral chip using the HSIC interface are welded on the same single board, and the two chips are powered on and powered off at the same time, resulting in a large power consumption of the device

Method used

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  • Awakening and hot-plugging methods and equipment based on high speed inter-chip (HSIC)
  • Awakening and hot-plugging methods and equipment based on high speed inter-chip (HSIC)
  • Awakening and hot-plugging methods and equipment based on high speed inter-chip (HSIC)

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Embodiment Construction

[0041] In order to make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be described clearly and completely in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of the embodiments of the present invention, not all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

[0042] The host involved in the embodiments of the present invention may be a central processing unit (CPU) on various terminals such as a personal computer, a mobile phone, a PAD, a wireless router, or a universal serial bus (Universal Serial BUS, USB) modem. An external device can be a peripheral chip such as a wireless fidelity (Wi...

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PUM

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Abstract

The embodiment of the invention provides awakening and hot-plugging methods and equipment based on a high speed inter-chip (HSIC). One method comprises the following steps that: a host computer acquires that external equipment connected with the host computer through an HSIC bus is in an idling state; the host computer is in a dormancy state; the host computer receives an interruption signal sent by the external equipment through a signal line connected with the external equipment; and the host computer is awakened from the dormancy state according to the interruption signal. Awakening and hot-plugging of the host computer and the external equipment are realized based on the HSIC bus, so that the power of the equipment is saved.

Description

Technical field [0001] The present invention relates to information technology, in particular to a wake-up and hot-swap method and equipment based on a high-speed interface HSIC between chips. Background technique [0002] At present, the High Speed ​​Inter-Chip (HSIC) uses Inter-Chip Connectivity (ICC) technology, which can realize the USB 2.0 protocol for short-distance transmission and maintain software compatibility with analog USB 2.0 connections. Sex. [0003] In the prior art, the host chip and the peripheral chip adopting the HSIC interface are welded on the same single board, and the two chips are powered on and powered off at the same time, so that the power consumption of the device is relatively large. Summary of the invention [0004] The embodiment of the present invention provides a wake-up and hot-plug method and device based on the HSIC high-speed interface between chips, which saves the power of the device. [0005] On the one hand, an embodiment of the present inv...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F13/38G06F1/32
CPCG06F1/325G06F1/3203G06F1/3253G06F13/10G06F1/3215Y02D10/00Y02D30/50
Inventor 桂永林赵阳朱光泽
Owner HUAWEI DEVICE CO LTD
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