Indirect cooling semiconductor refrigerating device

Abstract

The invention discloses an indirect cooling semiconductor refrigerating device. The indirect cooling semiconductor refrigerating device comprises a cooling cylinder, a semiconductor cooling piece, a radiating unit and a cold transfer unit. The cold transfer unit comprises a cold transfer heat tube internally provided with an evaporating medium, a plurality of cold transfer ribs and a refrigerating medium cylinder internally provided with a refrigerating medium. The cold transfer ribs are installed on the outer surface of the cold transfer heat tube. The cold transfer heat tube provided with the cold transfer ribs is installed in the refrigerating medium cylinder which is arranged in the cooling cylinder. The refrigerating medium cylinder is made of materials which meet the requirement of hygiene and safety of food. According to the indirect cooling semiconductor refrigerating device provided by the invention, an indirect cold transfer mode is adopted to solve the problem that the refrigerating medium freezes fundamentally, thereby improving the refrigerating efficiency of the semiconductor refrigerating system. The large diameter refrigerating medium cylinder is adopted to transfer cold, thus, as the cold transfer area is large, all waterborne materials meet the requirement of hygiene and safety of food and serve as the refrigerating medium, therefore, hygiene and safety of drinking water are guaranteed.

Description

technical field [0001] The invention relates to the field of water dispensers, in particular to an indirect cooling semiconductor refrigeration device. Background technique [0002] Since the refrigerant used in the traditional compression refrigeration system will cause the destruction of the atmospheric ozone layer and the greenhouse gas effect, the semiconductor refrigeration system has received more and more attention in the water dispenser industry. But there are following main problems in the existing semiconductor refrigeration device that is used for water dispenser: [0003] (1) The medium is used for heat transfer, and the efficiency of heat transfer depends on the heat transfer area and the thermal conductivity of the material. The area of ​​the semiconductor cooling chip is generally small, so the heat transfer density and temperature per unit area of ​​the heating surface material are too high to reach the semiconductor cooling effect. Under the working conditi...

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Problems solved by technology

Based on the same cooling surface area and material thermal conductivity as heat dissipation, the efficiency of aluminum blocks to transfer cold energy is also very low;

[0005] (3) The surface of the cooling aluminum block inserted into the water will freeze, and the longer the cooling time, the thicker the ice layer will be, resulting in a further reduction in cooling efficiency, and the water temperature cannot reach the ideal drinking temperature;

[0006] (4) Since the aluminum block is in direct contact with the drinking water in the cold tank, the aluminum block itself will precipitate heavy metal ions that are harmful to health. In addition, although the surface of the aluminum block can be oxidized and protected, in fact, the aluminum block is soaked in water for a long time. Severe corrosion occurs in the inside and the back, so the current cooling structure of the cold tank does not meet the hygienic requirements at all.

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