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System and method for measuring output voltage of chip internal power supply

A technology of internal power supply and output voltage, applied in the direction of measuring current/voltage, measuring device, measuring electrical variables, etc., can solve the problem that it is not convenient to measure the output voltage of the internal power supply of the chip

Active Publication Date: 2017-11-14
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it is not convenient to measure the output voltage of the internal power supply of the chip

Method used

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  • System and method for measuring output voltage of chip internal power supply
  • System and method for measuring output voltage of chip internal power supply
  • System and method for measuring output voltage of chip internal power supply

Examples

Experimental program
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no. 1 example

[0026] figure 1 A structural block diagram of a system for measuring the output voltage of a chip internal power supply according to an embodiment of the present invention is schematically shown.

[0027] Such as figure 1 As shown, the chip internal power supply output voltage measurement system according to the embodiment of the present invention includes: a testing machine 1 and a probe card 2 ; wherein the testing machine 1 is connected to the chip 3 to be tested through the probe card 2 .

[0028] Wherein, the testing machine 1 includes a driving voltage applying unit 11 and a power management unit 12 . And wherein, the driving voltage applying unit 11 is used to supply power to the internal power supply to ensure the accuracy of the power supply; the power management unit 12 is used to apply a driving current to the chip under test 3 to measure the chip under test 3 the internal power supply output voltage.

[0029] Furthermore, the first channel ch1 and the second cha...

no. 2 example

[0038] figure 2 A flow chart of a method for measuring the output voltage of a chip internal power supply according to an embodiment of the present invention is schematically shown.

[0039] Such as figure 2 As shown, the method for measuring the output voltage of the internal power supply of the chip according to the embodiment of the present invention includes:

[0040] Connect the testing machine 1 to the chip under test 3 through the probe card 2 (step S1 ); wherein, the testing machine 1 includes a driving voltage applying unit 11 and a power management unit 12 . And wherein, the driving voltage applying unit 11 is used to supply power to the internal power supply to ensure the accuracy of the power supply; the power management unit 12 is used to apply a driving current to the chip under test 3 to measure the chip under test 3 The output voltage of the internal power supply;

[0041] The first channel ch1 and the second channel ch2 of the testing machine 1 are shorted ...

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Abstract

The invention provides a system and a method for measuring output voltage of an internal power source of a chip. The system for measuring the output voltage of the internal power source of the chip comprises a tester and a probe card, the tester is connected to the to-be-measured chip by the probe card and comprises a driving voltage applying unit and a power management unit, the driving voltage applying unit is used for applying power to the internal power source to ensure power supply accuracy, the power management unit is used for applying driving current to the to-be-measured chip to measure the output voltage of the internal power source of the to-be-measured chip, a first channel and a second channel of the tester are in short circuit at an output end and are connected to an input port of the probe card, and the input port of the probe card corresponds to a pin of the to-be-measured chip.

Description

technical field [0001] The invention relates to a semiconductor manufacturing process, and more specifically, the invention relates to a system and method for measuring the output voltage of a power supply inside a chip. Background technique [0002] The entire process of semiconductor chip manufacturing is mainly composed of design, wafer manufacturing, packaging and testing. [0003] Among them, the test (Wafer test) is the first process of the semiconductor back-end packaging test. The test is also called needle test, wafer test, circuit probing (CP, Circuit Probing), wafer test (Wafer Sort), wafer test Circle detection (WaferProbing) and so on. The purpose of the mid-test is to pick out the bad chips in the silicon wafer. [0004] The equipment used in the test includes a tester (IC Tester), a probe card (Probe Card), a probe station (Prober) and an interface (Mechanical Interface) between the tester and the probe card. [0005] When testing the performance of the chi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R19/00
Inventor 桂伟任栋梁
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP