Up-and-down constant-temperature parameter identifying method for testing thermal interface material performance

A parameter identification method and technology of thermal interface materials, applied in the field of performance testing of thermal interface materials, can solve the problems of temperature measurement uncertainty error, difficult interface contact thermal resistance measurement accuracy, etc., achieve high-precision contact thermal resistance and eliminate inconsistencies The effect of sexual error

Active Publication Date: 2012-12-19
NANJING UNIV OF SCI & TECH
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Problems solved by technology

Most of the steady-state contact thermal resistance test methods are similar to the test standard equipment of the American National Standard ASTMD5470-06, but many documents point out that due to the uncertainty error of temperature measurement and heat loss error, it is difficult to ensure sufficient contact thermal resistance at the interface. high measurement accuracy

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  • Up-and-down constant-temperature parameter identifying method for testing thermal interface material performance
  • Up-and-down constant-temperature parameter identifying method for testing thermal interface material performance

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Embodiment Construction

[0029] Based on the American national standard ASTM D5470, the present invention proposes a method to measure the performance of the thermal interface material by using the upper and lower constant temperature parameter identification method. Constant temperature parameter identification eliminates the inconsistency error and heat loss error of each temperature sensor, combined with the controllable thermal radiation shield and auxiliary measures to reduce heat flow loss, to achieve the purpose of high-precision testing of thermal physical parameters of thermal interface materials, The method can measure the interface contact thermal resistance and the effective equivalent thermal conductivity after filling the thermal interface material with high precision.

[0030] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0031] combine figure 1 , the present invention discloses a device for measuring thermal interface ...

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Abstract

The invention discloses an up-and-down constant-temperature parameter identifying method for testing the thermal interface material performance. The up-and-down constant-temperature parameter identifying method comprises the following steps: step one, preparing a standard material thermal flow meter; step two, placing a thermal interface material between contact interfaces of two thermal flow meters, loading pressure stress, and heating the thermal flow meters forward; step three, amending measuring temperature of a test point; step four, calculating a contact thermal resistance R; and step five, measuring the thickness L of the thermal interface material, and calculating the equivalent heat conducting coefficient of the thermal interface material. According to the invention, a symmetrical testing structure which is amended by up-and-down constant-temperature parameter identification is adopted for measuring, the inconsistent error of temperature measurement caused by different contact thermal resistance of each temperature sensor and the thermal flow meters or incomplete linearity of temperature and the like can be eliminated, and further the performance of the thermal interface material with high accuracy can be measured on the premise that the thermal flow rate is ensured.

Description

technical field [0001] The invention belongs to the technical field of testing, and in particular relates to a contact thermal resistance test method and equipment, which are suitable for testing the interface thermal resistance of commonly used materials, especially for performance testing of thermal interface materials. Background technique [0002] Contact thermal resistance is a parameter affected by many factors such as material properties, mechanical properties, surface morphology, contact pressure, temperature, and gap material. According to whether the experimental heat flow is stable, the contact thermal resistance measurement methods are generally divided into transient method and steady state method. Transient method is also a commonly used experimental measurement method of thermal contact resistance, which mainly includes laser photothermal measurement method, thermal imaging method, "flash" flash method, laser photoacoustic method, etc., and laser photothermal ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N25/20
Inventor 宣益民张平李强徐德好
Owner NANJING UNIV OF SCI & TECH
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