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Electronic equipment

A technology of electronic equipment and conductive foil, which is applied in the field of electronic equipment, can solve problems such as the thickness of electronic equipment, and achieve the effect of reducing thickness

Inactive Publication Date: 2016-03-30
KK TOSHIBA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, electronic equipment including printed circuit boards may be thick

Method used

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  • Electronic equipment
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Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0024] figure 1 A television set 81 according to the first embodiment is illustrated. The television 81 is an example of "electronic equipment". The television 81 includes a main body 82 and a stand 83 supporting the main body 82 . The main body portion 82 includes a housing 84 and a display device 85 provided in the housing 84 . The display device 85 includes a display screen 85, and an image is displayed on the display screen 85a. The housing 84 includes an opening 84a through which the display 85a is exposed.

[0025] Such as figure 1 As shown, the housing 84 accommodates the flexible printed wiring board 1 . Instead of the flexible printed wiring board 1 according to the first embodiment, the case 84 may accommodate the flexible printed wiring board 1 according to the following second or third embodiment.

[0026] Hereinafter, the flexible printed wiring board 1 will be described in detail.

[0027] figure 2 , 3 , 4, 5 and 6 illustrate the flexible printed wiring...

no. 2 example

[0093] Figure 7 A flexible printed wiring board 1 according to the second embodiment is shown. The flexible printed wiring board 1 according to this embodiment has a non-uniform thickness. For example, the flexible printed wiring board 1 includes a first part 31 and a second part 32 thicker than the first part 31 .

[0094] The first portion 31 is a region in which no components (eg, electronic components) are mounted and has high flexibility (eg, bendability). The first portion 31 has basically the same structure as the flexible printed wiring board 1 according to the first embodiment. That is, the first part 31 includes the first insulator 2 , the via hole 3 , the first conductive pattern 4 , the second conductive pattern 5 , the first covering layer 6 and the second covering layer 7 .

[0095] The second portion 32 is a region where a component 34 (for example, an electronic component) is mounted and is less deformed (ie, bent) than the first portion 31 . The second pa...

no. 3 example

[0099] Figure 8 A flexible printed wiring board 1 according to the third embodiment is shown. exist Figure 8 , for the convenience of explanation, the first conductive pattern 4 is shaded. In the flexible printed wiring board 1 according to this embodiment, different kinds of insulating materials are partially used. Such as Figure 8 As shown, the first conductive pattern 4 (or the second conductive pattern 5 ) includes a pad 41 and a signal line 42 connected to the pad 41 . The signal line 42 is, for example, wiring for high-speed transmission (for example, a differential line).

[0100] The flexible printed wiring board 1 according to this embodiment includes a first portion 43 and a second portion 44 . The first portion 43 is, for example, an area where the signal line 42 is not provided. The first portion 43 has substantially the same structure as the flexible printed wiring board 1 according to the first embodiment. That is, the first part 43 includes the first i...

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PUM

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Abstract

According to one embodiment, an electronic device is characterized by including a housing (56, 84) and a flexible printed wiring board in the housing (56, 84). A flexible printed circuit board (1) includes a through hole (3), an insulator (2), a first conductive pattern (4) and a second conductive pattern (5). The insulator (2) is coated around the through hole (3) and includes a first face (2a) and a second face (2b) opposite to the first face (2a). The first conductive pattern (4) is connected to the via (3) on the first face (2a). The second conductive pattern (5) is connected to the via (3) on the second face (2b).

Description

technical field [0001] Embodiments described herein relate generally to electronic devices. Background technique [0002] A printed wiring board having a through hole is provided by laminating a copper foil on a substrate, opening a hole with a drill, and plating the inner surface of the hole. [0003] In the case of performing plating to form a through hole, a part of the plating layer is further laminated on the copper foil laminated on the base material. Therefore, it is possible to increase the thickness of the printed wiring board. Therefore, electronic equipment including printed wiring boards may be thick. Contents of the invention [0004] It is an object of the present invention to provide an electronic device with reduced thickness. [0005] According to an embodiment, an electronic device includes a housing and a flexible printed wiring board in the housing. The flexible printed wiring board includes: a through hole, an insulator coated around the through ho...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04N5/64H05K1/02H05K1/11H05K3/40
CPCH04N5/64H05K3/4069H05K2201/1034H05K2203/0278H05K1/0393H05K3/281
Inventor 八甫谷明彦鸟越保辉玉井定广
Owner KK TOSHIBA