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A rapid determination method for nickel corrosion in the electroless nickel-gold process of printed circuit boards

A technology for printed circuit boards and electroless nickel deposition, which is applied in the field of quality inspection of printed circuit boards electroless nickel deposition process, can solve the problems of inconvenient on-site timely control and parameter adjustment, long analysis cycle, expensive cost, etc., to save testing Cost and test time, the effect of control parameters improvement

Active Publication Date: 2016-01-13
SHENZHEN CHENGGONG CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is to provide a quick determination method for nickel corrosion in the chemical precipitation nickel-gold process of printed circuit boards, which overcomes the expensive cost, long analysis period and inconvenient on-site timely control and parameter adjustment brought by SEM instrument testing , does not directly reflect the influence of the corrosion degree of the nickel layer on the welding performance

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A method for quickly determining nickel corrosion in a printed circuit board electroless nickel-gold manufacturing process, the method has the following steps in sequence:

[0024] (1), prepare the mixed solution of sodium persulfate 100g / L and AR grade sulfuric acid 20ml / L;

[0025] (2) According to the size and requirements of the printed circuit board, the mixed solution is configured as a working solution and placed in the container;

[0026] (3) Put the same five printed circuit boards produced simultaneously on the electroless nickel-gold production line into the configured working solution at the same time, record the time, and take out a sample after every 30 seconds;

[0027] (4) After all the above-mentioned printed circuit boards are taken out, select all the samples respectively and use a slicing punch to cut out the test points of the same size, and use the gold refund potion to return the gold of the test points as required;

[0028] (5) Use a metallograp...

Embodiment 2

[0033] A method for quickly determining nickel corrosion in a printed circuit board electroless nickel-gold manufacturing process, the method has the following steps in sequence:

[0034] (1), prepare the mixed solution of sodium persulfate 100g / L and AR grade sulfuric acid 20ml / L;

[0035] (2) According to the size and requirements of the printed circuit board, select the spray equipment and select the appropriate slot to configure the working fluid;

[0036] (3) Put the same printed circuit boards produced simultaneously on the chemical immersion nickel gold production line into the spraying equipment for horizontal micro-etching treatment, use the horizontal micro-etching equipment, adjust the equipment to normal production parameters, and test all samples 1, 2, 3, 4, and 5 horizontal micro-etches were performed in sequence.

[0037] (4) After all the above-mentioned printed circuit boards are taken out, select all the samples respectively and use a slicing punch to cut ou...

Embodiment 3

[0043] A method for quickly determining nickel corrosion in a printed circuit board electroless nickel-gold manufacturing process, the method has the following steps in sequence:

[0044] (1), prepare the mixed solution of hydrogen peroxide 100ml / L and AR grade sulfuric acid 20ml / L;

[0045] Steps (2)-(8) are the same as (2)-(8) in Embodiment 1.

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PUM

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Abstract

The invention discloses a method for rapidly judging nickel corrosion of chemical nickel gold immersion process of a printed circuit board, and the method comprises following steps of selecting micro-etch agent; preparing working liquid; preparing a template; preparing a standard template card: after gold on a test point of the printed circuit board to be tested is removed, comparing with a standard template card to obtain a judgment result grade; and enabling the printed circuit board to be tested to be subjected to tin drift and tin immersion test, and comparing with the standard template card to obtain a judgment result grade. The method can rapidly analyze and detect the real situation of a nickel layer in the production process so as to supply data support for the on-site parameter control. Through the method, the influence of the chemical nickel gold immersion corrosion problem on the surface mounting technology (SMT) welding can be spontaneously controlled by a printed circuit board enterprise, the problem can be rapidly found out, the control parameters can be adjusted for the improvement, and the test cost and the test time can be greatly reduced.

Description

technical field [0001] The invention relates to a quality detection technology of a printed circuit board chemical immersion nickel-gold process, and more specifically relates to a rapid nickel corrosion determination method for a printed circuit board chemical immersion nickel-gold process. Background technique [0002] The electroless nickel-gold process is an important process in the production of printed circuit boards. The main principle is: use a chemical method to plate a layer of nickel and then a layer of gold on the copper circuit of the printed circuit board to increase the corrosion resistance of the circuit and the product. Anti-aging properties, improve product performance and service life. This process is mostly used in the production of high-demand printed circuit boards. The quality of electroless nickel-gold plating directly affects the effect of subsequent SMT parts and the use of finished products. As the precision of electronic products is getting highe...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N17/00
Inventor 田华陈建平李云华
Owner SHENZHEN CHENGGONG CHEM
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