Clamping device and method with function of monitoring status of semiconductor wafer
A clamping device and semiconductor technology, which is applied in semiconductor/solid-state device manufacturing, measuring devices, optical devices, etc., can solve the problems of wafer clamping, wafer detachment, loss of wafers, etc., to avoid clamping looseness and stability Enhanced, easy-to-achieve effects
Active Publication Date: 2015-08-05
BEIJING SEVENSTAR ELECTRONICS CO LTD
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Problems solved by technology
However, the chuck clamps the wafer too tightly and it is easy to pinch the wafer, but if the chuck is not tight, the wafer is easily detached from the chuck and broken during the rotation operation.
And the generation of these two kinds of situations all can wear wafer, make the production cost of wafer manufacture greatly improve
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[0027] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.
[0028] The purpose of the present invention is to accurately determine whether the wafer is clamped on the chuck to reduce the risk of wafer breakage. In the present invention, an optical fiber micro-bending pressure sensor is placed at the center of the bottom of the wafer, and the deformation of the optical fiber is monitored to determine whether the wafer is clamped; and then the chuck is adjusted according to the status of the feedback wafer. The apparatus of the present invention enables the chucking operation to stop precisely at the end of the operation, ie the point at which the wafer is in the desired state.
[0029] Such as figure 1 , figure 2 As shown, the d...
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The invention relates to the technical field of cleaning semiconductor integrated circuit components, and discloses a clamping device with a function of monitoring the state of a semiconductor chip. The clamping device comprises a rotatable chuck, a rotating shaft arranged on the geometric center of the chuck, a sensor fixed on the rotating shaft, and at least three clamping components distributed on the chuck. The invention also provides a method of monitoring the state of the semiconductor chip. The wafer is released or clamped through relative rotation of the cam and the chuck; and the clamping device has a simple structure, and is easy to realize; and further, whether the wafer is clamped is accurately measured by the sensor, the wafer is avoided being loosely clamped due to over-small clamping force or the wafer is avoided being damaged due to overlarge clamping force, and the stability is improved.
Description
technical field [0001] The invention relates to the technical field of semiconductor integrated circuit device cleaning, in particular to a clamping device and method capable of monitoring the state of a semiconductor wafer. Background technique [0002] As the feature size of integrated circuits enters the deep sub-micron stage, wafer cleaning has developed from simple groove cleaning to single-chip cleaning with higher precision. While performing single-wafer cleaning, it is necessary to use a chuck to fix the wafer so that it can be rotated. However, if the chuck clamps the wafer too tightly, it is easy to crush the wafer, and if the chuck is not tight, the wafer is easy to break away from the chuck and break into pieces when the chuck is rotated. The occurrence of these two situations will consume the wafer, which greatly increases the production cost of wafer manufacturing. Contents of the invention [0003] (1) Technical problems to be solved [0004] The technica...
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IPC IPC(8): H01L21/687G01B11/02
Inventor 刘伟吴仪张豹
Owner BEIJING SEVENSTAR ELECTRONICS CO LTD