Disk clamping device

Abstract

The invention discloses a disk clamping device, relating to the technical field of semiconductor wafer techniques. The disk clamping device comprises a chuck main body, a cam, a rotating shaft and at least three clamping components, wherein the rotating shaft is installed on the chuck main body, has a common axial line with the chuck main body, and is used for driving the chuck main body to rotate; the cam is rotatably installed on the chuck main body, and has a common axial line with the chuck main body; the clamping components are installed on the chuck main body; the non-clamping end of each clamping component props against the movable surface of the cam through a limit stop block; the limit stop block is used for fixing the clamping component in the radial direction of the chuck main body when the cam rotates along with the chuck main body; and the movable surface is used for enabling the clamping components to move outward in the radial direction of the chuck main body when the cam rotates relative to the chuck main body. According to the invention, clamping of a disk is realized without damaging the clamped object, and the clamping position of the manipulator is not limited.

Description

technical field [0001] The invention relates to the technical field of semiconductor wafer technology, in particular to a disc clamping device. Background technique [0002] The most widely used wafer chucks are pin chucks, Bernoulli suction cups, etc. In the U.S. patent that application number is US5513668 and US4903717, disclose a kind of chuck that utilizes Bernoulli's principle that wafer is fixed, utilize Bernoulli's principle to form one deck air cushion between chuck and wafer, utilize air cushion to keep wafer, Radial positioning is achieved by clamping elements distributed around the wafer circumference. This structure well reduces the contact between the wafer and the chuck, thereby reducing damage to the wafer. However, it is determined that the manipulator can only clamp the wafer through the upper surface of the wafer, and the manipulator that is currently used more often clamps the wafer from the lower surface of the wafer, which has certain limitations. [...

AI Technical Summary

Problems solved by technology

[0003] Disclosed in the patent US6167893 is to use the centrifugal force acting on the clamping element to clamp the wafer. This structure is relatively simple, but the clamping element is easy to generate a bending moment on the wafer so as to easily cause damage to the wafer; when the wafer When the speed is low, the centrifugal force acting on the clamping element is low, so it is easy to produce relative sliding between the wafer and the clamping element, which can easily cause damage to the wafer

Images