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Heat pipe

A heat pipe and flat heat pipe technology, applied in the field of heat pipes, can solve the problems of small liquid return resistance, large capillary force, small capillary force, etc., achieve small liquid return resistance, large capillary force, and improve the characteristics of anti-gravity Effect

Inactive Publication Date: 2013-01-16
FURUI PRECISE COMPONENT (KUNSHAN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, because different types of capillary structures have different effective capillary pore sizes, that is, the grooved capillary structure has a larger effective capillary pore size, and its capillary force is small and the resistance to liquid reflux is also small; while sintered powder and wire mesh Since the capillary structure forms a porous structure, although it can generate greater capillary force, as the pores become smaller, the resistance to liquid return is also large.
Therefore, the single capillary structure can bear almost the same maximum heat flux density in each part of the heat pipe, and cannot simultaneously have a small liquid return resistance and a large capillary force.

Method used

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Embodiment Construction

[0013] figure 1 A schematic axial cross-sectional view of the first embodiment of the heat pipe of the present invention. In this embodiment, a straight tubular heat pipe is taken as an example. The heat pipe 100 includes a tubular casing 10 , an appropriate amount of working medium 20 filled in the casing 10 , and a capillary structure assembly 30 covering the inner wall of the casing 10 .

[0014] Please also see figure 2 , the cross-section of the housing 10 is circular, and it can be made of metal materials with good thermal conductivity such as copper and aluminum. A sealed cavity 50 is formed in the housing 10 , and the cavity 50 is usually evacuated to a vacuum or close to a vacuum to facilitate the evaporation of the working medium 20 when heated. The working medium 20 can be a liquid with high latent heat such as water, alcohol, ammonia water and mixtures thereof.

[0015] The capillary structure assembly 30 includes a multilayer capillary structure 32 . In this ...

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Abstract

The invention provides a heat pipe. The heat pipe comprises a sealed housing, a chamber body formed into the housing, and a working medium filled into the chamber body; a capillary structure assembly is arranged on the internal wall of the housing; the capillary structure assembly includes a plurality layers of capillary structures; layers of capillary structures are arranged from the internal wall of the housing to the centre of the chamber body layer by layer; and moreover, the capillary aperture of each layer of capillary structures is sequentially reduced from the internal wall of the housing to the centre of the chamber body, thus, the heat pipe has lower liquid reflowing resistance and higher capillary force.

Description

technical field [0001] The invention relates to a heat transfer device, in particular to a heat pipe. Background technique [0002] At present, heat pipes are widely used in heat dissipation of electronic components with large heat generation due to their fast heat transfer speed. [0003] Existing heat pipes usually include a hollow and airtight shell, a capillary structure inside the shell and a working medium filled in the shell. The capillary structure usually adopts a single type of capillary structure, that is, a single groove structure, a single sintered Powder structure or single screen structure. However, because different types of capillary structures have different effective capillary pore sizes, that is, the grooved capillary structure has a larger effective capillary pore size, and its capillary force is small and the resistance to liquid reflux is also small; while sintered powder and wire mesh Since the capillary structure is formed into a porous structure, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28D15/04
CPCF28D15/04F28D15/046
Inventor 代升亮刘悦申海萍陈文虎吴佳鸿罗友梁
Owner FURUI PRECISE COMPONENT (KUNSHAN) CO LTD