Structure of heat sink and manufacturing method

A technology of heat dissipation device and manufacturing method, which is applied in the direction of cooling/ventilation/heating transformation, indirect heat exchanger, lighting and heating equipment, etc. It can solve the problem of increased material cost, capillary force is not as good as sintering, and troubles manufacturing developers and users, etc. question

Inactive Publication Date: 2006-09-13
DELTA ELECTRONICS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Although this type of grooved capillary structure 15 has better permeability, its capillary force is not as good as that of the sintered capillary structure 13. For a long time, this defect has troubled manufacturers, developers and users
A

Method used

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  • Structure of heat sink and manufacturing method
  • Structure of heat sink and manufacturing method
  • Structure of heat sink and manufacturing method

Examples

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Embodiment Construction

[0028] Please refer to Figure 4 , the heat dissipating device of the present invention can be realized by a heat uniform chamber (vapor chamber). The heat dissipation device includes a cavity 30 and a capillary structure 40 formed inside the cavity 30 . The capillary structure 40 also includes a porous powder 41 (sintered powder) sintered on the inner wall of the cavity 30 at high temperature, and a plurality of grooves 42 formed on the inner wall of the cavity 30 . With the help of the above structure, the cooling device has both the better capillary force of the sintered capillary structure and the better permeability of the grooved capillary structure. Perfectly protect the heat-generating components it is connected to (for example: CPU).

[0029] Here, it must be added that the cooling device is additionally filled with a working fluid (such as inorganic compounds, water, alcohols, liquid metals, ketones, refrigerants, or organic compounds), and the working fluid can be...

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Abstract

This invention discloses a radiating device, which can be a uniform heat cavity combined with any heating components. The device includes a closed cavity and a capillary structure formed on the inside wall of said cavity, in which, said capillary structure includes multiple grooves formed on the inside wall of the cavity and porous powder sintered under high temperature on the inside wall , thus the radiating device has good capillary force of sintered capillary structure and penetrability of groove structure to speed up the radiation backflow of the working liquid and increase the radiation efficiency of the device.

Description

technical field [0001] The invention relates to a structure of a heat dissipation device and a manufacturing method thereof, in particular to a heat dissipation device with high capillary force and high permeability and a manufacturing method thereof. Background technique [0002] With the advancement of technology, the number of electronic components per unit area of ​​electronic equipment is increasing, which causes the heat generated by the electronic equipment to increase accordingly. Therefore, in order to maintain the electronic equipment at an effective working temperature, most of the current methods use external fans and heat dissipation fins to achieve heat dissipation. [0003] Since the heat pipe can transmit a large amount of heat over a considerable distance with a small cross-sectional area and temperature difference, and can operate without an external power supply, under the consideration of no need to provide power and economical use of space , the heat pi...

Claims

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Application Information

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IPC IPC(8): H01L23/427H05K7/20F28D15/02
Inventor 庄明德林祺逢陈锦明
Owner DELTA ELECTRONICS INC
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