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Built-in self-test system aiming at micro-electro-mechanical integrated system

A built-in self-test and integrated system technology, applied in the field of built-in self-test systems, can solve problems such as unfavorable MEMS system productivity and test quality, and can not meet the high-reliability function requirements of real-time detection and repair of MEMS products, etc. The effect of improving test coverage and improving test quality

Active Publication Date: 2014-09-24
JIANGSU R & D CENTER FOR INTERNET OF THINGS
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Problems solved by technology

[0003] Existing MEMS test schemes are often integrated after testing the mechanical and circuit parts of the system separately, which is not conducive to improving the yield and test quality of the integrated MEMS system; on the other hand, the existing MEMS design schemes often cannot Meet the high reliability functional requirements of real-time detection and repair of MEMS products in the application process

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Embodiment Construction

[0015] Hereinafter, the present invention will be described in further detail with reference to the drawings.

[0016] figure 1 The target system targeted by the present invention is given: the basic structure of a micro-electromechanical integrated system, which is generally mainly composed of mechanical parts (including sensors and actuators) that interact with the external natural world, analog circuit parts that quantify and process mechanical component information, and The digital circuit part responsible for analyzing, calculating and correcting the collected information consists of three parts. In the process of its work, on the one hand, many information in the external world, including speed, temperature, light, etc., can be sensed by sensors in MEMS and converted into analog electrical signals. The analog signals are filtered and amplified by MEMS. Converted into a digital signal output that can be processed and distinguished by humans; on the other hand, we can also co...

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Abstract

The invention provides a built-in self-test system aiming at a micro-electro-mechanical integrated system. According to the built-in self-test system, the output end of a pseudo random digital test excitation signal generator is sequentially connected with a digital test excitation and analog excitation signal converter and an electric excitation signal and mechanical excitation converter; an output of the electric excitation signal and mechanical excitation converter works on a mechanical part to be tested; a physical test response of the mechanical part to be tested is connected to a mechanical response and analog response converter and an analog response and digital response converter sequentially; the output end of the analog response and digital response converter and the output end of the pseudo random digital test excitation signal generator are connected to a desired response comparator; and if the system reports error, an actual test response sequence is sent out of a chip and is used for fault diagnosis. The built-in self-test system makes full use of the advantages of a built-in self-test scheme; the test quality of the micro-electro-mechanical integrated system is improved, and the test cost is reduced; and a real-time detection function is supplied to the micro-electro-mechanical integrated system.

Description

Technical field [0001] The invention relates to the technical field of reliability design of a micro-electromechanical integrated system, in particular to a built-in self-test system that can be applied to a microelectromechanical integrated system. Background technique [0002] According to the analysis report of the International Technology Roadmap for Semiconductors (ITRS: International Technology Roadmap for Semiconductors) in recent years, Micro-Electromechanical System (MEMS) has become the core development direction of the "Post Moore's Law" route. However, because MEMS usually integrates devices with different structures including digital circuits, analog circuits, sensors, actuators, and memories, it requires a diversified and integrated test access mechanism; in addition, because MEMS is usually used for reliability In fields with high requirements and not easy for people to directly control, such as aerospace, automobiles, biomedicine, environmental monitoring, communi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/3167
Inventor 李佳王玮冰
Owner JIANGSU R & D CENTER FOR INTERNET OF THINGS