Component mounting and dispatching optimization method for chip mounter on basis of quantum neural network

Abstract

The invention provides a component mounting and dispatching optimization method for a chip mounter on basis of a quantum neural network. The component mounting and dispatching optimization method comprises the steps of establishing a mathematical model of the sum of paths required by the operation of mounting all components on a printed circuit board (PCB) according to an operating principle of mounting the components by a suction nozzle of the chip mounter, wherein the distances between all the mounted components and different feed tanks are taken as input vectors of the quantum neural network, and all weighting values are set as small random numbers, and given input vectors and target output vectors of a training set are provided; and calculating overall optimal solution of the established mathematical modeling by adopting a three-layer quantum neural network algorithm, thus obtaining an optimized component mounting and dispatching scheme corresponding with the sum of the shortest mounting patches of all the components, the optimal mounting order of all the components, and the arrangement positions of feeders of the components in the feed tanks. The component mounting and dispatching optimization method constructs the component mounting and dispatching mathematical model which takes both the component mounting order and the feeder arrangement positions into consideration, obtains the optimal control on the mounting and dispatching of the components in the PCB, shortens the mounting time of single-end arch components, and enhances the mounting and production efficiency of the components of the chip mounter.

Description

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine

Login to View More

AI Technical Summary

Benefits of technology

The technical effect of this patented technology lies on optimizing part assembly processes by predicting how well parts are going where they will be placed next based upon their location within an installation area or queue. This helps reduce downtime while improving productivity.

Problems solved by technology

This patented describes how optimizing the placements during printing processes helps increase manufacturing efficacy while reducing costs associated with defects caused by poorly placed parts. Specifically, it suggests improving the placer's order assignment based upon its grip pattern and position relative to the substrate being assembled onto. Additionally, there are proposals about quantifying the impact of placing machines over their lifespan. These improvements aimed at increasing the overall performance of the printer itself through improved plaque dispensation accuracy and shorter cycle times.

Images