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Component mounting and dispatching optimization method for chip mounter on basis of quantum neural network

A technology of quantum nerves and optimization methods, which is applied to the biological neural network model and the assembly of printed circuits with electrical components, can solve problems such as increased optimization solution time and complex mathematical models for placement scheduling, so as to shorten the placement time and improve The effect of production efficiency

Inactive Publication Date: 2015-03-18
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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Problems solved by technology

As the number of mounted components increases, the mathematical model of component placement scheduling becomes more complex, and the optimization solution time increases rapidly

Method used

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  • Component mounting and dispatching optimization method for chip mounter on basis of quantum neural network
  • Component mounting and dispatching optimization method for chip mounter on basis of quantum neural network
  • Component mounting and dispatching optimization method for chip mounter on basis of quantum neural network

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Embodiment Construction

[0013] The quantum neural network-based placement scheduling optimization method for placement machine components of the present invention will be described in detail below with reference to the accompanying drawings.

[0014] as attached figure 1 , in the quantum neural network-based component placement scheduling optimization method of the present invention, the working principle of component placement is: first, the placement head moves to the position of the component intelligent feeder, and absorbs the component device; then the placement head moves to the position of the first component to complete the placement of component 1, and then moves to the position of the second device to complete the placement of device 2, and repeats the cycle of placement until the PCB on the All components are mounted.

[0015] An optimization method for placement scheduling of placement machine components based on quantum neural network, the specific process is as follows:

[0016] Step ...

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Abstract

The invention provides a component mounting and dispatching optimization method for a chip mounter on basis of a quantum neural network. The component mounting and dispatching optimization method comprises the steps of establishing a mathematical model of the sum of paths required by the operation of mounting all components on a printed circuit board (PCB) according to an operating principle of mounting the components by a suction nozzle of the chip mounter, wherein the distances between all the mounted components and different feed tanks are taken as input vectors of the quantum neural network, and all weighting values are set as small random numbers, and given input vectors and target output vectors of a training set are provided; and calculating overall optimal solution of the established mathematical modeling by adopting a three-layer quantum neural network algorithm, thus obtaining an optimized component mounting and dispatching scheme corresponding with the sum of the shortest mounting patches of all the components, the optimal mounting order of all the components, and the arrangement positions of feeders of the components in the feed tanks. The component mounting and dispatching optimization method constructs the component mounting and dispatching mathematical model which takes both the component mounting order and the feeder arrangement positions into consideration, obtains the optimal control on the mounting and dispatching of the components in the PCB, shortens the mounting time of single-end arch components, and enhances the mounting and production efficiency of the components of the chip mounter.

Description

technical field [0001] The invention relates to a component mounting control technology of a chip mounter, in particular to a joint optimization method of mathematical modeling of component mounting scheduling of a chip mounter, component mounting path planning and feeder position allocation. Background technique [0002] Surface mount technology (SMT) is an electronic assembly technology that directly pastes and solders surface mount components (components without pins or short pins) to specified positions on the surface of a printed circuit board. The circuit board does not need to drill the insertion hole. With the rapid development of electronic product assembly technology, surface mount technology has become the core of printed circuit board (PCB) circuit assembly technology. Advanced SMT technology has been widely used in electronic industries such as household appliances, computers and mobile communications. [0003] The placement machine has been widely used in the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/30G06N3/02
Inventor 王友仁孙权
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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