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High-output low-attenuation white light LED (light emitting diode) and manufacturing method thereof

A technology of white light and fluorescent powder, which is applied in the direction of electrical components, electrical solid devices, circuits, etc., to reduce adverse effects, solve heat dissipation and improve light extraction efficiency

Active Publication Date: 2015-02-18
吴江市民福电缆附件厂
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention aims at the deficiencies in the existing white light LED structure and packaging process, and provides a high output and low attenuation white light LED structure and manufacturing method

Method used

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  • High-output low-attenuation white light LED (light emitting diode) and manufacturing method thereof
  • High-output low-attenuation white light LED (light emitting diode) and manufacturing method thereof
  • High-output low-attenuation white light LED (light emitting diode) and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Embodiment 1, white light LED structure, such as Figure 1-2 shown.

[0029] A white light LED, comprising a chip 4, a wire 6, a base 3 with a circuit, and a bracket cup 5, the shape of the base is adapted to the bracket cup, and it is placed in the bracket cup 5, and the chip 4 is solidified On the base 3, the positive and negative poles of the chip 4 are welded to the circuit of the base 3 through the welding wire 6 (wire); The distance between the circular film 1 and the upper surface of the chip 4 is 3 millimeters; there are two silica gel injection holes 2 on the circular film, with a diameter of 2 millimeters, which are symmetrically arranged near the edge of the circular film; the chip 4 and the circular film 1 between filled with silicone 7. The chip 4 is a high-power sapphire substrate gallium nitride blue LED tube core.

[0030] The phosphor model used is 00902 (yellow-green), Hongda Trading Co., Ltd.; the silica gel model is OE-6550A / B, a product of Dow Co...

Embodiment 2

[0042] Embodiment 2, the LED structure as described in Embodiment 1, the difference is:

[0043] The distance between the circular film 1 and the upper surface of the chip 4 is 4 millimeters; there are three silica gel injection holes 2 on the circular film, with a diameter of 1.5 mm, which are arranged at equal intervals with the center of the circular film as the center point.

Embodiment 3

[0044] Embodiment 3, LED structure as described in embodiment 1, the difference is that the preparation method is as follows:

[0045] In step (1), the mixture of fluorescent powder and silica gel is mixed at a mass ratio of 0.2:0.8, the baking temperature is 175°C, and the baking time is 15 minutes; in step (4), mold strips are selected for packaging, and the outer sealing is formed.

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Abstract

The invention relates to a high-output low-attenuation white light LED (light emitting diode) and a manufacturing method of the white light LED. The white light LED comprises a chip, a lead, a base provided with a circuit and a bracket bowl cup, wherein the base is arranged inside the bracket bowl cup; the chip is fixed on the base; a circular thin film prepared by the mixture of fluorescent powder and silicon gel is arranged at the upper edge of the base; and the part between the chip and the circular thin film is filled with silicon gel. According to the cut circular thin film, the primarily screened fluorescent powder of large particles in the mixture of the fluorescent powder and the silicon gel are uniformly mixed, so that the light emission efficiency of the LED is increased, and the quality of the white light LED is improved.

Description

technical field [0001] The invention relates to a high-output and low-attenuation white light LED and a manufacturing method thereof, belonging to the technical field of optoelectronic applications. Background technique [0002] As a new type of industry, the semiconductor industry has formed a relatively mature process route from upstream chip production to midstream LED packaging and final application. There are also many ways to make white LEDs. In the commonly used blue-light chips to excite yellow phosphors, the conventional method is to directly coat the phosphors on the chips. Reduced, color shift, affected by phosphor particle size, low white light efficiency. CN101807659A (CN201019063026.X) provides a white light LED packaging method of partially spraying phosphor powder. After the LED chip is solidified on the power type bracket and wires are bonded, the LED bracket is placed in a mold to expose the chip and the edge area; The atomizing nozzle of the melter atomi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/50H01L33/54H01L33/00
CPCH01L2224/45144H01L2224/48091
Inventor 唐学建赵霞焱黄寿东刘长江张成山
Owner 吴江市民福电缆附件厂
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