Composite board of copper-foil-bonded ceramic substrate and preparation method of composite board

A ceramic substrate and composite board technology, applied in the field of composite boards, can solve problems such as waste of energy, cumbersome manufacturing process, and time-consuming

Active Publication Date: 2013-02-13
ZHEJIANG IND & TRADE VACATIONAL COLLEGE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The existing method of bonding copper foil to ceramic substrates disclosed by similar technologies is mainly to generate a copper oxide layer on the surface of copper foil, and then attach the copper foil to the ceramic substrate and put them in a vacuum furnace. Direct bonding (DBC) at the temperature of the melting point of copper requires a cumbersom

Method used

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  • Composite board of copper-foil-bonded ceramic substrate and preparation method of composite board
  • Composite board of copper-foil-bonded ceramic substrate and preparation method of composite board
  • Composite board of copper-foil-bonded ceramic substrate and preparation method of composite board

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Embodiment Construction

[0038] The structure and preparation method of the composite panel of the present invention will be explained below in conjunction with examples.

[0039] refer to Figure 1 to Figure 5 Shown is the composite plate of copper foil bonded ceramic substrate of the present invention, its double-sided bonded copper foil, including ceramic substrate and copper foil, the ceramic substrate is made of aluminum oxide or aluminum nitride powder material, using a thin strip scraper Molding or powder compaction molding process The powder material is sintered into a ceramic substrate under atmospheric or oxygen-free high temperature (1900°C)1( figure 1 ), the preparation method of the composite board is as follows:

[0040] Step 1, the upper and lower surfaces of the ceramic substrate 1 are sputtered with a copper film 2 ( figure 2 ), to form a copper film with a thickness of less than 1 μm on the surface of the ceramic substrate, the operating temperature of the DC power sputtering mach...

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Abstract

The invention discloses a composite board of a copper-foil-bonded ceramic substrate and a preparation method of the composite board. The composite board comprises a ceramic substrate, wherein a copper film is plated on at least one surface of the ceramic substrate to form a copper dielectric layer on the surface of the ceramic substrate, the ceramic substrate plated with a thin copper film layer is put in a thermal treatment furnace and subjected to reduction, a copper foil and the copper dielectric layer of the ceramic substrate are glued, and a binding layer is formed by mutual diffusion of copper ions on the copper foil and aluminum ions on the ceramic substrate. Correspondingly, the invention further provides a preparation method of the composite board. According to the composite board of the copper-foil-bonded ceramic substrate and the preparation method of the composite board of the copper-foil-bonded ceramic substrate, the technique is advanced, the copper foil and the ceramic substrate are directly bonded into the composite board by virtue of a diffusion bonding technique, and the manufacturing process is simple and the energy source is saved.

Description

technical field [0001] The invention relates to a composite board, in particular to a composite board with copper foil bonded to a ceramic substrate. Background technique [0002] At present, the method of bonding copper foil and ceramic substrate is widely used as direct bonding copper technology (abbreviated as DBC, Direct Bonding Copper). The main process is to first form a copper oxide layer on the surface of copper foil, and then to The foil is attached to the surface of the ceramic substrate with an oxide surface layer, and is eutectically sintered in a vacuum furnace at a temperature of 1065-1083 ° C. The copper foil will be directly bonded to the surface of the ceramic substrate. [0003] Existing technologies, such as U.S. Patent No. 5490627 describe the method of direct bonding copper (DBC) of copper-tungsten alloy on the surface of alumina ceramic substrate. Copper atoms are diffused on the surface of copper-tungsten alloy at a temperature of 1200 ° C, and then th...

Claims

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Application Information

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IPC IPC(8): B32B18/00B32B15/04
Inventor 钟振忠
Owner ZHEJIANG IND & TRADE VACATIONAL COLLEGE
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