Using method of polyimide (PI) ink

A technology of ink and substrate, applied in the application field of PI ink, can solve problems such as poor effect, achieve the effects of saving production time, improving technical indicators, improving precision and quality

A technology of ink and substrate, applied in the application field of PI ink, can solve problems such as poor effect, achieve the effects of saving production time, improving technical indicators, improving precision and quality

CN102933033AActive Publication Date: 2013-02-13广州源康精密电子股份有限公司

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0051] The present invention will be further described in detail below in conjunction with the examples, but the embodiments of the present invention are not limited thereto.

[0052] A method for using PI ink is realized through the following seven steps.

[0053] (1) Prepare PI ink

[0054] The PI ink is a single-dose ink, without hardener and diluent, and without stirring. No hardener, no added thinner, and no stirring.

[0055] (2) printing

[0056] Use screen printing to uniformly print and coat a layer of corresponding photosensitive PI ink on the copper surface of the substrate that needs to be printed with PI ink.

[0057] The specific process of the screen printing method is as follows:

[0058] Use the basic principle that the mesh of the graphic part of the screen printing plate is ink-permeable, and the mesh of the non-graphic part is impermeable to ink. When printing, pour PI ink into one end of the screen printing plate, apply a certain pressure on the part ...

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PUM

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Abstract

The invention provides a using method of polyimide (PI) ink. The using method comprises the following steps of: mixing the PI ink, printing, pre-baking, aligning and developing. By the method, the problems in the general crystal violet lactone (CVL) production; a new production method is supplied by rationally using the PI ink, so that the precision and the quality of a finished product are effectively improved; various technologies of the finished product are obviously improved; moreover, the production time is saved by fining the production flow, so that labor and material resources are greatly saved; the total production cost is reduced; the production efficiency is promoted and improved; and active and deep benefits in actual production are realized.

Description

technical field [0001] The invention relates to the technical field of FPC, in particular to a method for using PI ink. Background technique [0002] With more and more functional requirements and stronger performance requirements of electronic products, electronic devices are bound to become "light, thin, short, small" and multi-functional. Corresponding to the development of electronic equipment, the wiring density of the corresponding FPC (printed board) becomes higher, and the alignment offset becomes smaller. In addition, the size of the PAD (pad) is getting smaller and smaller, and the overall production difficulty is getting more and more difficult. Therefore, the design and production requirements for FPC circuit graphics have also increased, especially due to the narrowing of the alignment offset (now 0.05mm), resulting in higher and higher precision between PAD and PAD. [0003] For the increasing line density and the high precision of offset and PAD, the current ...

Claims

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Application Information

Patent Timeline
13 Feb 2013
Publication
CN102933033A
IPC
H05K3/00; H05K3/06
Inventors
邓凯; 曾勇