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An electronic installating system

An electronic component installation and electronic component technology, applied in electrical components, electrical components and other directions, can solve the problem of easily producing semi-finished products, and achieve the effect of reducing semi-finished products, reducing work burden, and shortening total production time

Active Publication Date: 2013-02-13
FUJI KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In the production of double-sided mounting substrates, there is a problem that a double-sided mounting substrate 103 (in the Image 6 (f) with Image 6 (g) The double-sided mounting board 103 in the state between, that is, the unfinished double-sided mounting board 103 in which the electronic component 104 is mounted on one side and the electronic component 104 is not mounted on the other side
[0008] However, at this time, it is obviously easy to produce semi-finished products

Method used

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  • An electronic installating system
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no. 1 approach

[0052] Structure of Electronic Component Mounting System

[0053] First, the structure of the electronic component mounting system of this embodiment is demonstrated. figure 1 The schematic diagram which shows the electronic component mounting system of this embodiment. Such as figure 1 As shown, the electronic component mounting system 9 of this embodiment includes a control device 90 and a production line 91 .

[0054] The production line 91 includes a plurality of electronic component mounting machines 1 , a board appearance inspection machine 910 , and a reflow furnace 911 . A substrate (not shown) is conveyed from the left side (upstream side) to the right side (downstream side) on the production line 91 . The plurality of electronic component mounting machines 1 mount electronic components on the upper surface of the board in stages. The substrate appearance inspection machine 910 inspects the mounting state of electronic components on the substrate. The reflow ov...

no. 2 approach

[0114] The difference between the electronic component mounting system of the present embodiment and the electronic component mounting system of the first embodiment is that the selection between the continuous mode and the intermittent mode is performed not by the operator but by the control device. Here, only the differences are described. Also, in the description, citing Figure 1 to Figure 5 .

[0115] In the electronic component mounting system of this embodiment, figure 1 The control unit 90 automatically performs Figure 5 Mode selection of step 2 (S2). Specifically, mode selection is performed using the following equation (1).

[0116] T1×(N1-1)+T2>T3…(1) formula

[0117] In formula (1), T1 is the mounting time for each electronic component mounting machine to mount electronic components on one side of a double-sided mounting substrate based on production program A1 (for one-side production). N1 is the production number of double-sided mounting substrates (=30 (...

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Abstract

The present invention provides a way to consider the double-sided double-sided mounting board to determine whether to continuous production of the execution sequence of a plurality of production processes of the electronic component mounting system. Determining a plurality of the control means (90) of the electronic component mounting system (9) of the order of execution of the production process (A1 to E). A plurality of production processes (A1-E) including the production of double-sided mounting substrate side side program (A1) and the other surface of the other surface of the production procedure (A2). Continuous mode control means (90) considering the continuous implementation of the program side (A1) and the other side of the program (A2) and the interval of the production process (B to E) to intermittently perform side program (A1) and the other side of the program (A2 ) discontinuous mode is selected to determine the order of execution of a plurality of production processes (A1 to E).

Description

technical field [0001] The present invention relates to an electronic component mounting system that determines the execution order of a plurality of production programs performed in the same production line. Background technique [0002] Patent Document 1 discloses a component mounting method in which the production sequence of substrates is determined according to predetermined sorting conditions. In this patent document 1, as classification conditions, the degree of conformity of component supply units, the degree of conformity of component types, substrate support table ID, reflow oven ID, and the like are exemplified. [0003] For example, when the production order of substrates is determined by "sorting condition=degree of uniformity of component supply units", a plurality of substrates with high versatility of component supply units are continuously produced. Therefore, at the time of changing the substrate to be produced, that is, at the time of production changeove...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K13/04
Inventor 深尾和也村土浩章
Owner FUJI KK
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