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Adaptive power semiconductor module reliability test testing clamp

A power semiconductor, test and test technology, applied in the direction of single semiconductor device testing, measuring device casing, etc., can solve the problem of affecting the heat conduction and heat dissipation of the module bottom plate, inconvenience, etc.

Active Publication Date: 2013-02-27
XIAN POWER ELECTRONICS RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Before the power module leaves the factory, various factory tests and reliability tests must be carried out. In the reliability test of the module, in the past, the module was fixed on the heating plate or radiator by screws to achieve constant temperature or heat dissipation during the test process. Because there are many types of modules and different fixing methods, if they are all fixed by screws, many screw holes must be tapped on the heating plate or radiator, which will affect the heat conduction and heat dissipation of the module bottom plate, and it is extremely inconvenient in the actual test

Method used

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  • Adaptive power semiconductor module reliability test testing clamp
  • Adaptive power semiconductor module reliability test testing clamp
  • Adaptive power semiconductor module reliability test testing clamp

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Experimental program
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Effect test

Embodiment Construction

[0012] 1. Design points of the present invention

[0013] 1) Overall Mechanism Design

[0014] Adaptive power semiconductor module reliability test test fixture includes fixed plate 1, guide rod 2, radiator 3, heating plate 5, end thermal resistance 4, front and rear support screws 7, left and right sliding bars 8, sliding plate 9, upper fixing plate 10 and the trapezoidal screw 12, two guide rods 2 are fixed on the base plate 1, the upper fixed plate 10 and the upper end of the guide rod 2 are fixed to form a frame, the trapezoidal screw 12 is connected with the sliding plate 9 through the thrust bearing 14 and the screw connection sleeve 15, Rotating turntable 13 is housed on the trapezoidal screw 12, and guide sleeve 16 is installed on the sliding plate 9, and guide bar 2 passes guide sleeve 16 and can slide up and down, makes trapezoidal screw 12 and is fixed on upper fixed plate 10 by rotating turntable 13 The flange trapezoidal nut 11 rotates relatively, so that the sli...

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PUM

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Abstract

The invention relates to an adaptive power semiconductor module reliability test testing clamp. According to the clamp, two guide rods are fixed on a bottom plate; a trapezoidal lead screw is connected with a sliding plate through a lead screw connecting sleeve and a thrust bearing; a guide sleeve is arranged on the sliding plate; the guide rods penetrate through the guide sleeve and can slide up and down; a radiator is fixed on the bottom plate; a heating plate is arranged on the radiator; and a tested module is arranged on the heating plate. The clamp can be pressed on the heating plate according to different module appearances, so that the test temperature is constant. The position of a fixing hole can be adaptively adjusted according to different fixing styles of the module, the positions of a left-to-right sliding strip and a back-and-forth supporting screw rod of the clamp are adjusted, and the coordinates of the pressed module supporting screw rod is equivalently adjusted, so that the supporting screw rod is accurately positioned at the position of the module fixing hole. The clamp is applied to various power semiconductor module reliability test equipment at present.

Description

technical field [0001] The invention relates to a test fixture for the reliability test of power semiconductor modules, which can be press-fitted according to the shape of different power semiconductor modules and its fixing method, and is currently mainly used in power semiconductor module reliability test equipment, which can be heated through the bottom plate The system and heat dissipation system heat and control the temperature of the module under test. Background technique [0002] At present, in the field of power semiconductor applications, the application range of modules is becoming wider and wider, and there are more and more types of modules. In terms of functions, there are single-tube, single-phase rectifier bridge, three-phase rectifier bridge, full-control bridge, and half-control bridge. , series bridge arm, common cathode module, common anode module, etc. From the fixing method, there are single screw fixing, double screw fixing, four screw fixing and so on...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R1/04G01R31/26
Inventor 李更生肖秦梁乔宇郭杰
Owner XIAN POWER ELECTRONICS RES INST
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