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Optical projection mask aligner

A technology of optical projection and lithography machine, applied in optics, optical components, micro-lithography exposure equipment, etc., can solve problems affecting image quality, unable to produce high-quality lithography products, etc., and achieve the effect of real-time focusing

Inactive Publication Date: 2013-02-27
SHENZHEN SHENDA AURORA TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the above exposure process, the photosensitive material itself and the substrate coated with the photosensitive material have fluctuations and differences in thickness, and the focal plane position of the projection miniature lens may also have deviations, which will seriously affect the quality of the final generated image, making it impossible to produce high-quality products. Quality Lithographic Products

Method used

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  • Optical projection mask aligner
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Embodiment Construction

[0008] In order to make the purpose, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0009] The optical projection lithography machine proposed by the present invention is used to receive the laser light emitted by the laser device to expose the photosensitive material.

[0010] figure 1 Shown is an optical projection lithography machine according to an embodiment of the present invention, which includes: a spatial light modulator 1, a beam splitting system 2, a projection miniature lens 8, a focus adjustment device 11, and a photosensitive material support system 9, where the photosensitive material 10 is placed Above the photosensitive material support system 9 described above....

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Abstract

The invention discloses an optical projection mask aligner comprising a spatial light modulator, an optical splitting system, a projection reduction lens, a focusing regulating device and a photosensitive material supporting system, wherein the optical splitting system is composed of a one-half wave plate, a polarization splitting prism, a quarter wave plate, a baffle plate and a monitoring system; the spatial light modulator is used for modulating laser; the one-half wave plate is used for regulating the polarization direction of incident light; the incident light passes through the polarization splitting prism to obtain transmission light; the quarter wave plate is used for regulating the polarization direction of the transmission light; the incident light is imaged on a photosensitive material through the projection reduction lens, and meanwhile, reflected light is generated; and the reflected light passes through the quarter wave plate and the polarization splitting prism to generate third reflected light, the monitoring system is used for receiving the third reflected light and establishing an image, and the focusing regulating device is used for focusing the projection reduction lens. The optical projection mask aligner can be used for focusing the projection reduction lens in real time under the conditions that the photosensitive material and the substrate fluctuate and deviations exist on the focal plane of the projection reduction lens.

Description

technical field [0001] The invention relates to the technical field of lithography machine focusing, in particular to an optical projection lithography machine. Background technique [0002] Optical projection lithography machines are often used to manufacture diffractive optical elements, micro-optical elements, integrated circuits and microelectronic elements, and their main function is to expose. The optical projection lithography machine reduces the required image through the projection miniature lens, and images it on the photosensitive material, so that the photosensitive material undergoes a chemical reaction, and the required image is thus retained on the photosensitive material. In the above exposure process, the photosensitive material itself and the substrate coated with the photosensitive material have fluctuations and differences in thickness, and the focal plane position of the projection miniature lens may also have deviations, which will seriously affect the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/20G02B27/28
Inventor 王笑冰李建兵张海明
Owner SHENZHEN SHENDA AURORA TECH