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Convection heat radiation device

A technology of a heat dissipation device and a heat dissipation pipe, which is applied in the field of heat transfer, can solve the problems such as the limitation of the shape and space of the heat dissipation fins, the complicated manufacturing process of the heat dissipation fins, and the limitation of the frequency of removing dust, so as to improve the heat transmission speed, the heat dissipation performance is easy, the The effect of reducing heat dissipation

Active Publication Date: 2015-06-03
广州市珠江电线厂有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In heat dissipation technology, almost all the heat is dissipated into the air. Generally, in order to increase the surface area of ​​the part in contact with the air, a structure of multiple heat dissipation fins is often arranged side by side. Although this structure can increase the contact area with the air, However, it cannot be coordinated with the home environment, and it is difficult to directly use it as an appearance. It is often necessary to add a cover to the outside, which will inhibit the flow of air, and the designer has to introduce a fan.
In addition, the manufacturing process of the heat dissipation fins is complicated, the material cost is high, and the shape of the heat dissipation fins is severely limited by the space.
When dust adheres to the surface of the heat dissipation fins, the heat dissipation performance will be reduced, and these dusts are difficult to remove with a rag, and high-pressure airflow is often required, which greatly limits the frequency of dust removal and increases the cleaning cost

Method used

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  • Convection heat radiation device
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Embodiment Construction

[0017] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0018] The present invention will be further described in detail below in conjunction with the above-mentioned drawings and embodiments.

[0019] Examples of the present invention Figure 1 to Figure 3 Shown: the present invention is realized in this way, a kind of convection cooling device, is made up of fluid, fluid conduit 1 and heat dissipation pipe 2, and fluid conduit 1 is filled with fluid, and the bottom 4 of heat dissipation pipe is close to the outer surface of fluid conduit 1, and fluid The cross section of the conduit 1 is circular, the inner wall of the fluid conduit 1 is pasted with ...

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Abstract

The invention discloses a convection heat radiation device comprising fluid, a fluid guide tube and heat radiation tubes. The fluid is filled in the fluid guide tube, the heat radiation tubes are closely attached to the surface of the fluid guide tube, the cross section of the fluid guide tube is circular, a spiral partition is attached to the inner wall of the fluid guide tube, and the width of the partition is equal to the radius of the fluid guide tube. The convection heat radiation device has the advantages of simple structure, low manufacturing cost, easiness in dust removal, no fan and noise and easiness mounting and extending, and is simulated in bionic-plant modeling appearance and easily accepted by people.

Description

technical field [0001] The invention belongs to the technical field of heat transfer, and in particular relates to a convection cooling device. Background technique [0002] Fan cooling is a commonly used heat dissipation method at present. The disadvantages are noise, energy consumption, dust and air exchange are adversely affected by the environment. Convection heat dissipation is a fanless heat dissipation mode. At present, the commonly used convection heat dissipation method is to use thick metal parts to increase the contact area between the heat source and the air. This will increase the cost of heat dissipation. At the same time, the heat source and metal parts The distance is also limited by the heat transfer distance and efficiency of the heat pipe. More importantly, this heat dissipation method cannot be applied to high-power heat dissipation, and is limited by the structure of existing electronic products. Therefore, how to successfully apply convection heat diss...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
Inventor 任立元
Owner 广州市珠江电线厂有限公司
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