Film curing device
A technology of curing device and furnace cavity, which is applied in the device for coating liquid on the surface, pretreatment surface, coating, etc., can solve the problems of low film curing efficiency, long time consumption, long heating time, etc., to reduce the heating time and Turnaround time, improved efficiency, effect of reduced turnaround time
Active Publication Date: 2015-07-15
BOE TECH GRP CO LTD +1
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Problems solved by technology
[0003] However, the existing heating furnace is heated by heat conduction. It takes about 25 minutes to heat up to 230°C. The heating time is relatively long. After the heating is completed in the heating furnace, it must be put into the cooling furnace for cooling, which requires a certain amount of turnover. time; therefore, the process of film curing using a heating furnace and a cooling furnace takes a long time, and the efficiency of film curing is low
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[0021] In the existing film curing process, the heating method of heat conduction is generally used for film curing, and the heating time is long. Moreover, after the heating is completed, it needs to be cooled in the cooling furnace, which requires a certain turnaround time. Therefore, the use of heating furnace and cooling The process of film curing in an oven takes a long time, and the film curing efficiency is low.
[0022] In view of this, the present invention provides an improved technical solution, which uses microwave heating to solidify the film, which will shorten the heating time; and set the heating and cooling in the same device, reducing the turnaround time, thereby improving the film curing efficiency.
[0023] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.
[0024] First o...
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The invention relates to the technical field of the manufacturing of liquid crystal display, in particular to a film curing device, which is used for improving the film curing efficiency. The invention discloses a film curing device, which comprises a furnace body with a furnace chamber, a furnace door which is arranged on the furnace body, a microwave heating unit which is arranged inside the furnace chamber, a control unit which is connected with the microwave heating unit through a signal and used for controlling the microwave intensity and heating time and an intake and exhaust unit which is arranged inside the furnace chamber. By adopting a microwave heating way, when a heated material is cured and heated, the heated material can reach a set heating temperature within a short time; in addition, the film curing device also can be used for cooling after the heating and temperature increase, so that the cycling time from a heating furnace to a cooling furnace can be reduced; and therefore, when the film curing device is used for curing the film, the film curing efficiency can be increased.
Description
technical field [0001] The invention relates to the technical field of liquid crystal display manufacturing, in particular to a film curing device. Background technique [0002] Film curing refers to the process of heating the photoresist or alignment film coated on the substrate to undergo a chemical reaction, including two stages of heating and cooling, which are completed in the heating furnace and cooling furnace respectively; specifically, the coated The substrate with photoresist or alignment film is placed in a heating furnace to be heated to make the photoresist or alignment film react, and then the substrate is placed in a cooling furnace to cool and solidify. [0003] However, the existing heating furnace is heated by heat conduction, and it takes about 25 minutes to heat up to 230°C. The heating time is relatively long, and after the heating is completed in the heating furnace, it must be put into the cooling furnace for cooling, which requires a certain amount of...
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IPC IPC(8): B05D3/02B05D3/00
Inventor 任文明
Owner BOE TECH GRP CO LTD