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High-temperature-resistant toughened light-cured resin composition and preparation method thereof

A light-curing resin and composition technology, applied in the direction of additive processing, can solve the problems of low curing efficiency, slow printing speed, affecting the application and development of high-temperature resistant materials, etc., to achieve high curing efficiency, increase curing speed, and improve printing. slow effect

Active Publication Date: 2017-12-26
HANGZHOU LEYI NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the fact that some functional additives and non-curable fillers are often added to the formula of high-temperature-resistant light-curable materials, the resin material has disadvantages such as slow printing speed and low curing efficiency during the printing process. Application and development of high temperature resistant materials

Method used

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  • High-temperature-resistant toughened light-cured resin composition and preparation method thereof
  • High-temperature-resistant toughened light-cured resin composition and preparation method thereof
  • High-temperature-resistant toughened light-cured resin composition and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] A new type of high temperature resistant and toughened photocurable resin composition is composed of the following raw materials: 7 parts by weight of CN9006 (Sartomer), 5 parts by weight of EB639 (Cytec), 3,4-epoxycyclohexylcarboxylic acid-3',4 47 parts by weight of '-epoxycyclohexyl methyl ester, 20 parts by weight of reactive diluent isobornyl acrylate, 1 184 3 parts by weight of free radical initiator, 4 parts by weight of triarylsulfonium hexafluoroantimonate (cation initiator) , 10 parts by weight of polycaprolactone diol, 0.3 parts by weight of leveling agent, 0.3 parts by weight of defoamer, 0.3 parts by weight of wetting and dispersing agent, 3 parts by weight of nano silicon dioxide, and 0.1 part by weight of titanium dioxide.

[0043] The preparation technology of described photocurable resin comprises the following steps:

[0044] Weigh 7 parts by weight of CN9006 (Sartomer), 5 parts by weight of EB639 (Cytec), 47 parts by weight of 3,4-epoxycyclohexylcarboxyl...

Embodiment 2

[0046] A new type of high temperature resistant and toughened photocurable resin composition is composed of the following raw materials by weight: 7 parts by weight of CN9006 (Sartomer), 5 parts by weight of EB639 (Cytec), 3,4-epoxycyclohexylcarboxylic acid-3 43 parts by weight of ', 4'-epoxycyclohexyl methyl ester, 20 parts by weight of isobornyl acrylate reactive diluent, 1 184 3 parts by weight of free radical initiator, triarylsulfonium hexafluoroantimonate (cationic initiator) 4 parts by weight, 10 parts by weight of polycaprolactone diol, 0.3 parts by weight of leveling agent, 0.3 parts by weight of defoamer, 0.3 parts by weight of wetting and dispersing agent, 4 parts by weight of nano-core-shell rubber MX154, nano-silica 3 parts by weight, and 0.1 parts by weight of titanium dioxide.

[0047] The preparation technology of described photocurable resin comprises the following steps:

[0048] Weigh 7 parts by weight of aliphatic polyurethane acrylate CN9006 (Sartomer), 5...

Embodiment 3

[0050] A high-temperature-resistant photocurable resin composition is composed of the following raw materials by weight: 7 parts of CN9006 (Sartomer), 5 parts of EB639 (Cytec), 3,4-epoxycyclohexylcarboxylic acid-3',4'- 42.5 parts of epoxy cyclohexyl methyl esters, 20 parts of reactive diluent isobornyl acrylate, 1 184 3 parts of free radical initiators, 0.5 parts by weight of free radical initiator 2 dibenzoyl peroxide (BPO), cationic initiator triaryl 4 parts of sulfonium hexafluoroantimonate, 10 parts of polycaprolactone diol, 0.3 parts of leveling agent, 0.3 parts of defoaming agent, 0.3 parts of wetting and dispersing agent, 4 parts by weight of nano core-shell rubber MX154, nano 3 parts of silicon dioxide, 0.1 part of titanium dioxide.

[0051] The preparation process of the photocurable resin is as follows:

[0052] Weigh 7 parts of CN9006 (Sartomer), 5 parts of EB639 (Cytec), 42.5 parts of 3',4'-epoxycyclohexylmethyl 3,4-epoxycyclohexylcarboxylate, reactive diluent acr...

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Abstract

The invention discloses a high-temperature-resistant toughened light-cured resin composition and a preparation method thereof. The composition contains the following raw materials: acrylic resin, epoxy resin, an active diluent, a free radical initiator 1, a free radical initiator 2, a cationic initiator, polyol, a leveling agent, an antifoaming agent, a wetting dispersing agent, nano-core-shell rubber, nano-silicon oxide and a pigment. According to the resin composition, the curing rate of high-temperature-resistant light-cured resin can be effectively increased, and the initial strength of a product is greatly enhanced; furthermore, the material further has relatively high tenacity, so that the operations of punching, screw drilling and the like can be realized on a sample. Therefore, the high-temperature-resistant toughened light-cured resin composition has the characteristics of high curing efficiency and initial strength, excellent high temperature resistance, good tenacity and stable dimension.

Description

technical field [0001] The invention relates to the technical field of photocurable materials, in particular to a novel high temperature resistant and toughened photocurable resin composition and a preparation method thereof. Background technique [0002] Photocuring technology is an efficient, environmentally friendly, energy-saving, high-quality material surface treatment technology, known as a new technology for the green industry in the 21st century. Photocuring resin is the most important part of photocuring technology. It is composed of resin monomers and prepolymers, contains active functional groups, and can be polymerized by photoinitiators under ultraviolet light irradiation. [0003] In recent years, due to the strong support of the state, photocuring 3D printing technology has developed by leaps and bounds. Correspondingly, photosensitive resins have also achieved unprecedented development. People have higher requirements for 3D printing. And students, including...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L51/08C08L101/00C08K3/36C08K3/22C08F283/00C08F283/10C08F220/18C08F2/48C08F4/04C08F4/34B33Y70/00
CPCB33Y70/00C08F2/48C08F4/04C08F4/34C08F283/008C08F283/105C08K2003/2241C08K2201/011C08L51/08C08L2201/08C08L2205/025C08L2205/035C08L101/00C08K3/36C08K3/22C08F220/1811
Inventor 应慧春陈遒张小敏李芳
Owner HANGZHOU LEYI NEW MATERIAL TECH CO LTD
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