Preparation method of benzoxazine-containing resin composition, and prepreg and plywood produced from resin composition

Abstract

The invention relates to a preparation method of a benzoxazine-containing resin composition, and a prepreg and a plywood produced from the resin composition. The preparation method of the benzoxazine-containing resin composition is characterized in that an acidic filler is added to the benzoxazine-containing resin composition. The addition of the acidic filler to the resin composition greatly promotes the polymerization reaction of benzoxazine and epoxy resin, and reduces the solidifying temperature needed by polymerization of the benzoxazine and epoxy resin; and the plywood made of the composition containing the acidic filler has high anti-stripping stability, high glass transition temperature, low water absorption rate, high heat resistance, high bending strength and good technologic processability, and realizes low heat expansion coefficient.

Description

technical field [0001] The invention relates to the technical field of copper clad laminates, in particular to a preparation method of a composite material containing benzoxazine and a prepreg and a laminate made thereof. Background technique [0002] Benzoxazine is a kind of thermosetting polymer with excellent comprehensive performance, which has excellent molding processability and good comprehensive performance. The raw materials of the resin are widely sourced, cheap, and the synthesis process is simple; the curing reaction is ring-opening polymerization, and the outstanding features are no release of small molecules, small shrinkage, low porosity, and high dimensional accuracy; the cured product has a high glass transition temperature, high Elastic modulus, good heat resistance, high carbon formation rate, excellent flame retardancy and low water absorption. [0003] Benzoxazine resin has the ability to self-polymerize, but the polymerization temperature is above 200°...

AI Technical Summary

Problems solved by technology

[0006] At present, the commonly used methods to reduce the curing temperature of benzoxazine include adding various catalysts such as phenols or Lewis acids, which remain in the system in the original structure after the reaction, which has a certain negative impact on the heat resistance of the system. , while the high-boiling point organic acid will remain in the resin composition, which increases the risk of delamination and explosion of the PCB board during the manufacturing process

Therefore, for the application of benzoxazine resin, there has always been a difficult problem

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