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Micron flaky silver grains and production method thereof

A manufacturing method and micron-level technology, applied in the direction of adhesive additives, electrical components, circuits, etc., can solve the problems of energy consumption, different specifications of micron-level flaky silver particles, high environmental load, etc., to improve complex, The effect of economical and environmentally friendly process

Inactive Publication Date: 2013-04-03
CHINA STEEL
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] One aspect of the present invention is to provide a kind of manufacture method of micron flaky silver particle, it utilizes the concentrated nitric acid / silver nitrate of low weight ratio and the silver nitrate / reductive agent of high weight ratio, in the presence of surfactant, in liquid Phase reduction generates uniformly dispersed micron-sized flake silver particles with preset specifications, thereby improving the shortcomings of the existing process such as complexity, energy consumption, high environmental load, and different specifications of the obtained micron-sized flake silver particles

Method used

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  • Micron flaky silver grains and production method thereof
  • Micron flaky silver grains and production method thereof
  • Micron flaky silver grains and production method thereof

Examples

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Effect test

Embodiment 1

[0030] In this example, 10 g of silver nitrate was dissolved in 100 mL of pure water, and then 10 mL of 67 weight percent (wt %) concentrated nitric acid was added to form an acidic (pH<2) silver nitrate aqueous solution. Next, 3 g of a polyethylene glycol (MW=20000) surfactant solution was added to the acidic silver nitrate solution, and the mixture was appropriately stirred to disperse it uniformly to prepare a mixed solution (A).

[0031] In addition, 10 g of ascorbic acid or its derivatives (eg, its salts) were dissolved in 50 mL of deionized water to prepare a reducing agent solution (B).

[0032] Next, after adjusting the temperature of the above-mentioned two solutions to 30° C. with a heating device, the reducing agent solution (B) was poured into the mixed solution (A) and reacted for about 10 minutes. After that, the upper layer liquid was removed to separate the micron-sized flake silver particles. Then, the micron-sized flake silver particles are washed several ti...

Embodiment 2 to 8

[0034] With the manufacture method of the micron-level flaky silver grains of embodiment 1, difference is that embodiment 2 to 8 change the kind, usage amount and liquid phase reduction reaction temperature of composition, and its formula and detection result are such as table 1 and Figure 2 to Figure 8 shown.

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Abstract

The invention relates to micron flaky silver grains and a production method thereof; and nitric acid / silver nitrate with low weight ratio and silver nitrate / reductant with high weight ratio have reduction reaction in liquid phase under the action of surfactant to produce uniform and dispersed micron flaky silver grains with preset specifications. The obtained micron flaky silver grains can be added into conductive adhesive so as to form a back-side electrode of a solar cell base material.

Description

technical field [0001] The present invention relates to a kind of silver grain and its manufacture method, in particular to a kind of micron-scale flake silver grain and its manufacture method. Background technique [0002] Conductive adhesives are widely used in traditional thick films, solar cells, sensors, RFID antennas, and solid-state light-emitting materials. The materials of conductive adhesives can usually be divided into silver glue, aluminum glue and silver-aluminum glue. Generally speaking, silver glue is mostly used for the front electrode of solar cells (referred to as front silver), while aluminum glue and silver-aluminum glue are mostly used on the back of solar cells as back electrodes or wires connected in series with modules (referred to as back silver). As far as the conductive adhesive used for back silver is concerned, since the requirements for the size of conductive particles of back silver are not as high as that of front silver, mechanical grinding ...

Claims

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Application Information

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IPC IPC(8): B22F9/24C09J9/02C09J11/04H01L31/0224
Inventor 陈镱夫张瑞东
Owner CHINA STEEL
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