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Alkali cyanide-free copper-plated anode dissolving accelerator

A cyanide-free copper plating and anode dissolution technology, which is applied in the field of alkaline cyanide-free copper plating anode dissolution accelerator, can solve problems such as not specifying the plating solution, prevent anode passivation, stabilize the use of the plating solution, and ensure normal anode dissolution Effect

Inactive Publication Date: 2013-04-03
XIAMEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The report did not indicate the use of anodic stripping accelerators in the plating solution

Method used

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  • Alkali cyanide-free copper-plated anode dissolving accelerator
  • Alkali cyanide-free copper-plated anode dissolving accelerator

Examples

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Effect test

Embodiment 1

[0031] An alkaline cyanide-free copper-plating anode dissolution accelerator, its raw material components are calculated per kilogram of raw material, and its composition content is as follows:

[0032] Accelerator A 500g

[0033] Accelerator B 200g

[0034] Accelerator C 300g

[0035] The accelerator A is succinic acid (succinic acid); the accelerator B is maleic acid (maleic acid); the accelerator C is malonic acid;

Embodiment 2

[0043] An alkaline cyanide-free copper plating anodic dissolution accelerator, its raw material components are calculated per kilogram of raw material, and its composition content is as follows:

[0044] Accelerator A 800g

[0045] Accelerator B 100g

[0046] Accelerator C 100g

[0047] The accelerator A is 2-hydroxysuccinic acid (malic acid); the accelerator B is 2-hydroxypropionic acid (lactic acid); the accelerator C is adipic acid;

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Abstract

The invention discloses an alkali cyanide-free copper-plated anode dissolving accelerator and relates to a copper-plated anode. The accelerator comprises the following materials in parts by weight: 5-8 parts of accelerator A, 1-2 parts of accelerator B and 1-3 parts of accelerator C, wherein A is selected from 2-hydroxysuccinic acid(malic acid) and sodium salt or potassium salt thereof, or succinic acid (succinic acid) and sodium salt or potassium salt thereof; B is one substance selected from cis-butenedioic acid (maleic acid) and sodium salt or potassium salt thereof, trans-butenedioic acid (fumaric acid) and sodium salt or potassium salt thereof, and 2-hydracrylic acid(lactic acid) and sodium salt or potassium salt thereof; and C is one substance selected from malonic acid and sodium salt or potassium salt thereof, oxalic acid and sodium salt or potassium salt thereof, hydroxyacetic acid and sodium salt or potassium salt thereof, glutaric acid and sodium salt or potassium salt thereof, and adipic acid and sodium salt or potassium salt thereof. A, B and C are mixed to obtain the product. The alkali cyanide-free copper-plated anode dissolving accelerator can ensure that the anode dissolving is normal during a using process of a cyanide-free alkali copper-plating process using citrate or / and tartrate as complexing agent, and the plating solution is stably used for a long time.

Description

technical field [0001] The invention relates to a copper-plated anode, in particular to an alkaline cyanide-free copper-plated anode dissolution accelerator. Background technique [0002] Cyanide copper plating, as a pre-copper plating process for iron-based and zinc-based workpieces, can obtain a coating with good adhesion. However, the highly toxic cyanide in the cyanide copper plating process not only produces environmental pollution, but also affects the safety of operators and society. At present, a series of cyanide-free alkaline copper plating processes have been developed, such as citrate system, pyrophosphate system, polyphosphate (HEDP) system, tartaric acid system, triethanolamine system, ethylenediamine system, citrate - Tartrate mixed systems, etc. [0003] In order to really replace the cyanide copper plating process, the cyanide-free alkaline copper plating process needs to solve the following problems: 1. There is no replacement reaction between the copper ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38
Inventor 杨防祖蒋义锋吴德印田中群周绍民
Owner XIAMEN UNIV
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