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Organic light-emitting display with glass material packaging body and manufacturing method thereof

A light-emitting display and packaging technology, which is applied in semiconductor/solid-state device manufacturing, electric solid-state devices, semiconductor devices, etc., can solve problems such as difficult operation, easy cracking of substrates, increased diffusion range over time, etc., to achieve enhanced resistance to external forces Impact ability, effect of cushioning cutting stress

Active Publication Date: 2013-04-03
INNOLUX CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the operation time of this method increases with the viscosity of the filling material and the diffusion range has its limit. In addition, the filling process must be performed after cutting into a package structure, but the substrate will be due to lack of elasticity. Absorbing external force shocks is prone to brittle cracks. Therefore, as the number of the aforementioned packaging structures increases, it will also cause relative difficulty in operation.

Method used

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  • Organic light-emitting display with glass material packaging body and manufacturing method thereof
  • Organic light-emitting display with glass material packaging body and manufacturing method thereof
  • Organic light-emitting display with glass material packaging body and manufacturing method thereof

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Embodiment Construction

[0046] Below in conjunction with accompanying drawing and embodiment the present invention is described in detail:

[0047] Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same reference numerals.

[0048] refer to figure 1 , indicating that an array structure 2, commonly known as a mother board, includes several consecutively arranged packaging structures 3, commonly known as daughter boards. A preferred embodiment includes one of the aforementioned packaging structures 3 , a driving circuit, and a frame for accommodating the packaging structure 3 and the driving circuit.

[0049]The array structure 2 also includes a first mother substrate 21 including several first substrates 31 arranged continuously, and a second mother substrate stacked on the first mother substrate 21 and including second substrates 32 arranged continuously. 22. Several organic light-emitting units 33 respecti...

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Abstract

The invention discloses an organic light-emitting display with a glass material packaging body and a manufacturing method thereof. The display comprises a packaging structure, wherein the packaging structure comprises a first substrate, a second substrate, an organic light-emitting unit, a glass material packaging body and a first colloid, wherein the first substrate comprises at least one first substrate cutting side surface formed by cutting, the second substrate comprises at least one second substrate cutting side surface formed by cutting, the glass material packaging body is connected with the first substrate and the second substrate, and the first colloid comprises at least one colloid cutting side face which is formed by cutting and is adjacent to the first substrate cutting side surface and the second substrate cutting side surface. Therefore, when the packaging structure is cut by the first colloid, a function of buffering the cutting stress is realized, and the external force impact resistance of the packaging structure can be further enhanced. In addition, the invention also provides a method for manufacturing the organic light-emitting display.

Description

technical field [0001] The present invention relates to an organic light-emitting display and a manufacturing method thereof, in particular to an organic light-emitting display with a glass material package and a manufacturing method thereof. Background technique [0002] The packaging structure of a general organic light-emitting display includes a first substrate, a second substrate stacked on the first substrate, an organic light-emitting unit between the first substrate and the second substrate, and a The first substrate and the second substrate, and a glass material packaging body (frit) with good water vapor barrier and mechanical strength, through which the organic light-emitting unit of the packaging structure can be prevented from being affected by oxygen or water vapor , resulting in damage or reduced performance, and prolonging the life of the organic light emitting unit. [0003] The glass package is composed of a hot-melt inorganic ceramic and glass powder mate...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/52H01L27/32H01L51/56
CPCH10K59/10H10K50/80H10K50/84H10K71/00
Inventor 周政旭林敦煌黄浩榕周皓煜
Owner INNOLUX CORP
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