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Special ultraviolet curing pressure-sensitive adhesive tape for silicon wafer cutting and preparation method of adhesive tape
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A technology of silicon wafers and ultraviolet light, which is applied in the direction of adhesives, film/sheet adhesives, etc., can solve the problem of unfavorable pick-up performance of wafers and other devices, the stickiness of tapes cannot be controlled to be small, and it is easy to transfer to objects Surface and other problems, to achieve the effect of simple process, easy operation and strong adhesion
Active Publication Date: 2014-11-19
SICHUAN DONGFANG INSULATING MATERIAL
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[0003] In the prior art, there are mainly two methods for preparing UV-curable pressure-sensitive adhesives: one is to add low-molecular-weight reactive acrylate monomers or oligomers to the acrylate prepolymerized resin as the main component, and perform physical Stir and mix, although the adhesion performance of the adhesive tape prepared by this method can reach the requirements before and after ultraviolet light irradiation, the reactive acrylate monomer or oligomer has a low molecular weight (weight-average molecular weight 50gf / 25mm), which is unfavorable for the pick-up performance of wafers and other devices after dicing
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Embodiment 1-1
[0041] At room temperature 20Kg butyl acrylate, 55Kg isooctyl acrylate, 3Kg acrylic acid, 2Kg hydroxyethyl acrylate, 20Kg ethyl methacrylate, 100Kg solvent (ethyl acetate: toluene = 19:1), 0.5Kg benzyl peroxide Add the acyl acid to the reactor with condensing reflux device, control the temperature of the condenser at 15℃, stir at 200rpm, and mix uniformly; under the protection of nitrogen, gradually raise the temperature to 75℃, carry out the solution copolymerization reaction for 4h, stop heating, and end the reaction . Then add 50Kg of ethyl acetate to mix uniformly, cool to room temperature and discharge to obtain acrylic ester prepolymerized resin.
Embodiment 1-2
[0043] At room temperature, 50Kg butyl acrylate, 25Kg isooctyl acrylate, 5Kg acrylic acid, 2Kg hydroxyethyl acrylate, 18Kg ethyl methacrylate, 60Kg solvent (ethyl acetate: toluene = 11:1), 1.0Kg azobisiso Add butyronitrile into the reactor with condensing reflux device, control the temperature of the condenser at 15℃, stir at 100rpm, and mix uniformly; gradually increase the temperature to 80℃ under the protection of nitrogen, carry out the solution copolymerization reaction for 5h, stop heating, and react End. Then add 70Kg of ethyl acetate to mix uniformly, cool to room temperature and discharge, to prepare acrylic ester prepolymerized resin.
Embodiment 1-3
[0045] 30Kg butyl acrylate, 55Kg isooctyl acrylate, 3Kg acrylic acid, 4Kg hydroxyethyl acrylate, 10Kg ethyl methacrylate, 70Kg solvent (ethyl acetate: toluene=13:1), 0.5Kg benzyl peroxide at room temperature Add the acyl acid to the reactor with condensing reflux device, control the temperature of the condenser at 15℃, stir at 200rpm, and mix uniformly; under the protection of nitrogen, gradually raise the temperature to 75℃, carry out the solution copolymerization reaction for 4h, stop heating, and end the reaction . Then add 60Kg of ethyl acetate to mix uniformly, cool to room temperature and discharge to obtain acrylic ester prepolymerized resin.
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Abstract
The invention discloses a special ultraviolet curing pressure-sensitive adhesive tape for silicon wafer cutting. The ultraviolet curing pressure-sensitive adhesive tape consists of a polyester release film, ultraviolet curing pressure-sensitive adhesive and a film substrate, wherein the ultraviolet curing pressure-sensitive adhesive is mixed by 96.5-99 parts by mass of acrylate pre-poly resin, 96.5-99 parts by mass of polyurethane acrylate, 1-2 parts by mass of ultraviolet photoinitiator, and 1-5 parts by mass of curing agent. The preparation method comprises the following steps that the film substrate with a thickness of 0.05-0.25mm and a width of 500-2500mm is glued on a coating machine, is composited with the polyester release film with a thickness of 0.025-0.05mm and a width of 500-2500mm at 0.4MPa and at a room temperature, and finally is put into a 40-50 DEG C drying room for curing for 48-72h to form the pressure-sensitive adhesive tape. The prepared adhesive tape can also be used for the cutting of products such as circuit boards, optical glass, ceramics, and crystals.
Description
Technical field [0001] The invention relates to a special ultraviolet light curing pressure-sensitive adhesive tape for silicon wafer cutting and a preparation method thereof, and is particularly suitable for use as a special ultraviolet light curing pressure-sensitive adhesive tape for silicon wafer cutting. The adhesive tape can also be applied to circuit boards, optical glass, ceramics, etc. Cutting of crystal and other products. Background technique [0002] In the field of electronics industry, when semiconductor silicon wafers are diced, a UV-curable tape is required. Its main function is to fix large wafers and prevent wafers from cracking and splashing during dicing operations. After the wafer is processed or packaged by ultraviolet light, the adhesive force of the tape is greatly reduced, and it is easy to peel off and does not pollute the surface of the wafer. In addition to the application in wafer cutting, the product is also widely used in circuit board cutting, opt...
Claims
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Application Information
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