Heat pipe
A technology of heat pipes and heat insulation sections, which is applied in the field of heat conduction devices, and can solve the problems of unfavorable development needs of thin heat pipes and occupation of housing space
Inactive Publication Date: 2015-03-11
FURUI PRECISE COMPONENT (KUNSHAN) CO LTD +1
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Problems solved by technology
However, with the emergence of multi-functional and ultra-thin electronic products, the requirements for the performance and thinning of the heat pipe are also increasing. The existing capillary structure usually has a certain thickness, so it will occupy a large space in the shell, and it is not necessary Conducive to the development needs of thin heat pipes
Method used
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Embodiment Construction
[0013] figure 1 It is a longitudinal cross-sectional schematic view of the first embodiment of the heat pipe of the present invention. In this embodiment, a straight tubular heat pipe is taken as an example for illustration. The heat pipe 100 includes a tubular casing 10 , a closed inner container 20 disposed in the casing 10 , and a working medium 30 filled in the inner container 20 . One end of the heat pipe 100 is an evaporating section 11 , the other end is a condensing section 15 , and the adiabatic section 13 is connected between the evaporating section 11 and the condensing section 15 .
[0014] The cross-section of the housing 10 can be circular, flat or other shapes, and it is made of copper and other metal materials with good thermal conductivity. A sealed space 18 is formed in the casing 10, and the sealed space 18 is generally evacuated into a vacuum or close to a vacuum.
[0015] The inner container 20 is housed in the casing 10 and is made of soft metal and ha...
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A heat pipe comprises a sealed shell and a working medium. The heat pipe includes an evaporation section and a condensation section. The heat pipe further comprises a sealed inner container contained inside the shell. The inner container is made of soft metal material and size of the inner container can vary. The working medium is filled in the inner container. The inner container comprises a heat absorb part and a heat release part, wherein the heat absorb part and the heat release part are respectively flatly attached to and fixed on the inner wall of the shell. In the using condition, the heat absorb part of the inner container absorbs heat from the evaporation section to evaporate the working medium inside the inner container. The evaporated working medium of the inner container is abutted against the inner container and expand, enabling part of the outer wall of the inner container to abut against the inner wall of the shell and a plurality of rugged structures are formed on the inner wall of the inner container. The evaporated working medium liquefies when confronting cold and backflow to the evaporation section through the rugged structures. The inner container does not need to take up a large space inside the shell and adapts to a development demand of a light-type heat pipe.
Description
technical field [0001] The invention relates to a heat conduction device, in particular to a heat pipe. Background technique [0002] At present, heat pipes are widely used in heat dissipation of electronic components with large heat generation due to their fast heat transfer speed. Existing heat pipes generally include a hollow and airtight metal shell, a capillary structure inside the shell, and a working medium filled in the shell. The capillary structure is usually a grooved structure, a sintered powder structure or a wire mesh structure. . However, with the emergence of multi-functional and ultra-thin electronic products, the requirements for the performance and thinning of the heat pipe are also increasing. The existing capillary structure usually has a certain thickness, so it will occupy a large space in the shell, and it is not necessary Conducive to the development needs of thin heat pipes. Contents of the invention [0003] In view of this, it is necessary to...
Claims
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IPC IPC(8): F28D15/02
Inventor 谢宜莳
Owner FURUI PRECISE COMPONENT (KUNSHAN) CO LTD