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A small-size bond point double-wire bonding method

A bonding point and wire bonding technology, which is applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., can solve problems such as the inability to perform double-wire bonding, and achieve high reliability, high yield, and simple operation Effect

Active Publication Date: 2018-01-16
沈阳中光电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the pad size here is smaller than P, then two-wire bonding is not possible

Method used

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  • A small-size bond point double-wire bonding method
  • A small-size bond point double-wire bonding method
  • A small-size bond point double-wire bonding method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0017] As shown in the figure, assuming that the size of the pad on the chip is small and the pad on the substrate is large enough, the method of double-wire bonding of small-sized pads can be implemented in sequence as follows.

[0018] a. Bond the first wire 1 ; the second bonding point 102 of the first wire is placed on the chip 3 ; the wire ball 101 of the first wire is placed on the substrate 4 .

[0019] b. Bond the second wire 2; the wire ball 201 of the second wire is placed on the chip 3, and the second bonding point 202 of the second wire is placed on the substrate 4; the wire ball 201 of the second wire Bonded on the second bonding point 102 of the first wire.

[0020] The purpose of double-wire bonding is to improve the reliability of bonding, and it is generally used in products with relatively high reliability requirements. This is a two-wire bonding method suitable for small-sized pads. The small-sized pads mentioned here generally refer to the pads on the chip...

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PUM

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Abstract

The invention belongs to the technical field of integrated circuit manufacture and particularly relates to a small-size bonding point double-line bonding method. The following steps can be carried out in sequence that a, bonding a first line (1), wherein a second bonding point (102) of the first bonding line (1) is arranged on a chip (3) and a line ball (101) of the first line is arranged on a substrate (4); b, bonding a second line (2), wherein a line ball (201) of the second line is arranged on the chip (3) and a second bonding point (202) of the second line (2) is arranged on the substrate (4) and the line ball (201) of the second line is bonded on the second bonding point (102) of the first bonding line. The small-size bonding point double-line bonding method is easy to operate, high in integrated circuit reliability, high in rate of finished products and capable of achieving small-size pad chip batch bonding.

Description

technical field [0001] The invention belongs to the technical field of integrated circuit manufacturing, and in particular relates to a double-wire bonding method for small-sized bonding points. Background technique [0002] With the advancement of integrated circuit technology, the requirements for the integration of hybrid circuits are getting higher and higher, and the functions of chips are increasing, but the size is getting smaller and smaller, which leads to a significant increase in the area ratio of pads in the entire chip. It brings difficulties to normal double-wire bonding. However, wire bonding is a key technology in the semiconductor packaging process, which directly affects the reliability and yield of integrated circuits. [0003] see figure 1 As shown, at present, the conventional two-wire bonding process generally adopts the two-wire side-by-side bonding mode, which requires a larger size of the pad at the position of the wire ball. see figure 2 , the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/60
CPCH01L24/49H01L2224/48H01L2224/48465H01L2224/49H01L2224/49111H01L2224/49429H01L2224/78301H01L2224/85H01L2924/00012
Inventor 陈光孙永斌
Owner 沈阳中光电子有限公司