Continuous drying module for use in semiconductor integrated manufacturing production line

Abstract

The invention relates to the field of semiconductor integrated manufacturing, in particular to a continuous drying module for use in a semiconductor integrated manufacturing production line. The invention provides a continuous drying module for use in a semiconductor integrated manufacturing production line. Both sides of a shell are provided with an inlet and an outlet through which a conveying belt passes, and drum groups for dynamically clamping the conveying belt are arranged at the inlet and the outlet, so that the effect of dynamically sealing the shell and the conveying belt is achieved when the conveying belt passes through the shell from the inlet and the outlet. Due to the adoption of the continuous drying module provided by the invention, a continuous drying function on a photosemiconductor substrate can be realized, and the quality of a gas in the shell can be controlled in real time in a drying process; and meanwhile, a modular design of a drying process in the semiconductor integrated manufacturing production line is realized.

Description

technical field [0001] The invention relates to the field of semiconductor integrated manufacturing production equipment, in particular to a continuous drying module used in a semiconductor integrated manufacturing production line. Background technique [0002] Since the production process of semiconductor integrated manufacturing needs to be completed step by step by multiple processes, such as cleaning treatment, drying treatment, isolation treatment, PVD coating, etc., and each process step needs to be carried out in a closed environment, the existing In the technology, an integrated sealed manufacturing system is usually used, so that each step of the process can be carried out in the same closed environment. In the entire manufacturing process of semiconductor integrated manufacturing, the drying process is generally between the cleaning process and the isolation process. Its task is to dry the liquid contained in the cleaned semiconductor substrate for subsequent furth...

AI Technical Summary

Problems solved by technology

At present, the common drying method is hot nitrogen drying. Since the integrated sealing manufacturing system is usually used in the prior art to prepare semiconductor integrated manufacturing, in order to make the drying equipment well connected with other equipment, the structure of the drying equipment is complicated and the manufacturing cost is too high. high

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