Manufacturing process of multi-layer filter

Abstract

The invention discloses a manufacturing process of a multi-layer filter. The manufacturing process comprises the following steps of preparing a first lower conducting layer unit on a lower substrate, wherein the first lower conducting layer unit is provided with a first lower insulating layer and a plurality of first lower lead sections; preparing a second lower conducting layer unit on the first lower conducting layer unit, wherein the second lower conducting layer unit is provided with a second lower insulating layer, a plurality of second lower lead sections and a plurality of first middle lead sections; preparing a plurality of middle conducting layer units which are overlapped with one another, i.e. forming a plurality of perforations in an insulating material to form a middle insulating layer and arranging conducting materials in the perforations to form a plurality of first middle lead sections, second middle lead sections and iron core parts; and sequentially preparing a first upper conducting layer unit, a second upper conducting layer unit and an upper substrate. The multi-layer filter can be produced and prepared by a gradual layer preparation process without precise alignment, so that the production difficulty and the production cost are reduced.

Description

technical field [0001] The invention relates to a filter manufacturing process, in particular to a multilayer filter manufacturing process. Background technique [0002] A LTCC (Low Temperature Co-fired Ceramic) process was mentioned in the master's thesis of National Cheng Kung University in Taiwan, "Using Composite Materials to Realize Miniaturized Semi-lumped Low Temperature Ceramic Co-fired Filters". This process is to add other materials into the ceramic glass, and form a three-dimensional structure after multi-layer lamination. This structure can be used as a component or a substrate. The main steps of this kind of manufacturing process are to first perform the action of filling holes and wiring on multiple ceramic green bodies to form a ceramic substrate, and then align and stack the ceramic substrates, and finally perform cutting, co-firing, and the final process to complete the finished product . However, this process has the following disadvantages: [0003] Dur...

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Problems solved by technology

[0003] In the process of alignment and stacking, the position of the ceramic substrates must be adjusted very precisely, otherwise the ceramic substrates will not be able to conduct accurately with each other

Due to the high precision required by this process, it is difficult to apply this process, which greatly increases the production cost.

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