Preparation process for adhesive coated foil adhesive with high resistance to stripping and dip soldering

Abstract

The invention discloses a preparation process for an adhesive coated foil adhesive with high resistance to stripping and dip soldering. The preparation process comprises the following steps: a, blending 5 to 30 parts by mass of an epoxy resin and 1 to 20 parts by mass of a heterocyclic epoxy resin curing agent at a temperature of 30 to 60 DEG C for 3 to 5 h to uniformly mix the epoxy resin and the curing agent; and b, blending a uniformly dispersed mixture obtained in step a with 50 to 300 parts by mass of a thermosetting phenolic resin and 50 to 350 parts by mass of a polyvinyl acetal resin at a temperature of 30 to 60 DEG C for 5 to 12 h so as to realize compounding, with 600 to 1000 parts of toluene used as a solvent. According to the preparation process disclosed in the invention, the appropriate heterocyclic epoxy resin curing agent and the epoxy resin are subjected to compounding and modification, so the problems of dissolution and dispersion of resins with different dissolvability in methanol are overcome, and cost for preparation of copper foil glue is reduced; meanwhile, introduction of a heterocyclic epoxy resin enables anti-stripping strength and dip soldering resistance of adhesive coated foil to be improved.

Description

technical field [0001] The invention relates to an adhesive preparation process, in particular to an adhesive preparation process for a glue-coated copper foil with high peeling resistance and high dip soldering resistance Background technique [0002] Copper foil is an important material for the manufacture of copper clad laminates (CCL) and printed circuit boards (PCB). In the rapid development of today's electronic information industry, electrolytic copper foil is called the "neural network" of electronic product signal and power transmission and communication. The adhesive preparation of glued copper foil often adopts the preparation method of thermosetting phenolic resin, condensation product of polyvinyl alcohol and aldehydes together with epoxy resin. [0003] This method is a common preparation method for glued copper foil adhesives, but this preparation method has the following disadvantages: (1) The molecular weight distribution and solubility of the above resins ...

AI Technical Summary

Problems solved by technology

[0003] This method is a common preparation method for glued copper foil adhesives, but this preparation method has the following disadvantages: (1) The molecular weight distribution and solubility of the above resins are quite different, so to prepare a uniform glue system, it is necessary to Dissolving and dispersing it with a variety of solvents, the production cost is high; (2) The continuous improvement of customer demand makes manufacturers put forward higher requirements for the anti-peel strength and dip-soldering resistance of glued copper foil, and the above-mentioned commonly used The ability of the production process formula to meet the needs of customers is slightly insufficient

Images