Laminated base plate for drilling

Abstract

The invention provides a laminated base plate for drilling. Bleached kraft paper is used as a base material and is immersed into a phenolic resin polymer; a base material layer is molded by drying; the base material layer is cut into appropriate sizes by cutting work and is overlapped into a suitable laminated thickness according to requirements; the laminated base plate for drilling a hole with the size which is less than 0.1 mm, which is compactly combined with a plurality of the base material layers and has moderate hardness, is molded by hot pressing; a sheet material is subjected to plate detachment and quality detection (sheet material attribute detection), cutting, appearance checking and packaging; and therefore, the finished laminated base plate is used for the bottom of a circuit board, such as a high-precision circuit board and an IC (Integrated Circuit) carrier plate of a cell phone, to carry out precise small drilling machining work, so that the happening of drilling point abrasion rate and drilled hole reject ratio can be effectively reduced and the hole site precision is improved.

Description

technical field [0001] The invention relates to a laminated backing plate for drilling, especially for drilling of mobile phones or high-precision circuit boards. It can be laid on the bottom of the circuit board to prevent damage to the processing table and reduce small-diameter drill needles. Laminated backing plate for drilling due to wear rate and drilling defect rate. Background technique [0002] In the general circuit board industry, when drilling, it is laid on the bottom of the circuit board to prevent damage to the processing table. The laminated backing plate used as a bottom protection is mostly only taken from 6400kg of phenol and 4500kg of formaldehyde (44%). into the reaction tank, then add 20kg of basic catalyst and heat to 100°C and hold the temperature for 60 minutes, then cool to below 30°C to form a resin formula for kraft paper impregnation, so that the kraft paper is impregnated in the resin formula and After drying to an appropriate level, the kraft p...

AI Technical Summary

Problems solved by technology

[0002] In the general circuit board industry, when drilling, it is laid on the bottom of the circuit board to prevent damage to the processing table. The laminated backing plate used as a bottom protection is mostly only taken from 6400kg of phenol and 4500kg of formaldehyde (44%). into the reaction tank, then add 20kg of basic catalyst and heat to 100°C and hold the temperature for 60 minutes, then cool to below 30°C to form a resin formula for kraft paper impregnation, so that the kraft paper is impregnated in the resin formula and After drying to an appropriate level, the kraft paper impregnated with the resin formula is then thermally laminated to form a board with moderate hardness. However, the surface hardness and rigidity of this laminated backing board are too high. When the high-density requirement is less than 0.1mm drilling hole diameter processing, it is often easy to cause damage to the drill needle after drilling the bottom layer of the circuit board, or cause deviation of the drilling position, resulting in abnormal hole shape and burrs on the hole wall. causing a sharp increase in bad

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