Analog semi-rigid underlying structure temperature shrinkage fracture testing method and device

A technology of semi-rigid base and test method, which is applied in the field of tests and devices for simulating temperature shrinkage and fracture of semi-rigid base structures, can solve the problems of inability to simulate the actual boundary conditions of the base, and the workload is large, so as to save the workload and achieve a simple structure. Effect

Inactive Publication Date: 2013-05-01
程培峰
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  • Abstract
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Problems solved by technology

[0003] The purpose of the present invention is to propose a test method and device for simulating the temperature shrinkage fracture of a semi-rigid base structure, which solves the problem that the previous test method has a large workload and cannot simulate the actual boundary conditions of the base

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  • Analog semi-rigid underlying structure temperature shrinkage fracture testing method and device
  • Analog semi-rigid underlying structure temperature shrinkage fracture testing method and device
  • Analog semi-rigid underlying structure temperature shrinkage fracture testing method and device

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Embodiment Construction

[0019] An embodiment of the present invention will be further described below in conjunction with accompanying drawing:

[0020] The test method for simulating semi-rigid base structure thermal shrinkage fracture of the present invention: firstly carry out the making of test piece, select material according to the selection method of material of the present invention, select plexiglass plate and rubber tire as the material of simulating base and soil foundation. According to the principle of similarity, the thickness and width of the semi-rigid base structure and the plexiglass plate are proportional, and the strain gauges (9) are respectively pasted on the two sides of the plexiglass plate of the simulated base layer, and then the two plexiglass plates are connected with glue. together. After bonding, cut a section of tire and stick it on one side of the two boards as a material for simulating the soil foundation. Then the prepared test piece (10) is clamped on the device by...

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Abstract

The invention discloses an analog semi-rigid underlying structure temperature shrinkage fracture testing method and a device. The device mainly consists of a bracket, a gripping head, a screw rod, positioning bolts and a force sensor, and the selected materials of an analog test piece are organic glass plate and rubber tire. The testing method comprises the following steps: fixing a test piece pasted with a strain disc on the device through the gripping head, then placing in a temperature control test box, and connecting the strain disc and a strain box through a conducting wire which penetrates through the test box; turning the positioning bolts to apply a tensile force to the test piece through the control of the force sensor, and realizing the purpose of applying the tensile force to the test piece; and while applying the tensile force to the test piece, ensuring that the test piece and the gripping head are in the same plane, and fixing the test piece through a fastening bolt and the screw rod, so as to ensure that the test piece does not generate torsion. The method provided by the invention can simulate the fracture condition generated by fracture of a semi-rigid underlying structure after the action of temperature and load, and provides an effective way for research of underlying structure indoor analog and the fracture condition under the condition of temperature variation; and the structure is simple, the operation is convenient and the effect is good.

Description

technical field [0001] The invention relates to a simulation test method and device for subgrade pavement structures affected by environmental factors, in particular to a test method and device for simulating temperature shrinkage fracture of a semi-rigid base structure. Background technique [0002] In the process of expressway construction, more and more semi-rigid base structures are used. However, the reflection cracks frequently appear in this semi-rigid base are quite serious, which seriously affects the service condition and life of the road. In seasonally frozen regions or permafrost regions, the temperature shrinkage cracks are especially common and serious. The most notable feature of the semi-rigid base structure is its temperature shrinkage performance. At present, the temperature shrinkage performance test of semi-rigid base materials is almost always made of standard beam-type specimens. After curing, stick strain gauges and then put them into controllable In ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N3/18
Inventor 程培峰赵文美韩春鹏张姝婷尹传军
Owner 程培峰
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