A hot press device for high temperature adhesive curing

A technology of high-temperature adhesive and hot-pressing device, which is applied in the field of strain testing, can solve the problems of narrow application area and cumbersome high-temperature adhesive curing system, and achieve the effects of easy operation, uniform force, and simple design

Active Publication Date: 2016-03-02
TIANJIN AEROSPACE RELIA TECH +3
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The high-temperature adhesive curing system for thin-walled parts is more cumbersome and has a narrower application area

Method used

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  • A hot press device for high temperature adhesive curing
  • A hot press device for high temperature adhesive curing
  • A hot press device for high temperature adhesive curing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0057] Embodiment 1 of the present invention is as Figure 5 As shown, the attractive force of the magnet 5 of the present invention is directly adsorbed on the surface of the magnetic workpiece, and the rotating end cover 1 adjusts the threads of the force rod 3 and the base 4, so that the attractive force of the magnet 5 meets the test requirements. Because the frictional force of the bearing 11 is small, the force of rotating the end cover 1 is small, and the magnet 5 will not rotate with the rotation of the end cover 1 and the force rod 3 .

[0058] The magnet 5 applies force evenly to the high-temperature adhesive through the high-temperature rubber pad 7, changes the input of the peripheral power supply connected to the electrode 9, and adjusts the temperature of the electric heater 8 to meet the curing conditions of the high-temperature adhesive.

Embodiment 2

[0060] Embodiment 2 of the present invention is as Figure 6 Shown, two devices of the present invention are symmetrical to both sides of the thin-walled part, and are compressed by the attractive force of the magnet 5. Rotate the end cap 1 to adjust the threads of the force rod 3 and the base 4, so that the attractive force of the magnet 5 meets the test requirements. Because the frictional force of the bearing 11 is small, the force of rotating the end cover 1 is small, and the magnet 5 will not rotate with the rotation of the end cover 1 and the force rod 3 .

[0061] The magnet 5 applies force evenly to the high-temperature adhesive through the high-temperature rubber pad 7, changes the input of the peripheral power supply connected to the electrode 9, and adjusts the temperature of the electric heater 8 to meet the curing conditions of the high-temperature adhesive.

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PUM

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Abstract

The invention provides a hot press device for high temperature adhesive curing. The hot press device comprises an end cover (1), bolts (2), a force rod (3), a base (4), a magnet (5), a high temperature rubber pad (7), an electric heating sheet (8), an electrode (9), a lead hole (10), a bearing (11), and a core shaft (12). The base (4) is of a cylindrical structure with an inverted U-shaped cross section; the upper bottom surface is provided with a through hole and the inner wall of the through hole is provided with a thread. The base (4) provides support, and the magnet (5), the high temperature rubber pad (7) and the electric heating sheet (8) are arranged in the base (4). The magnet (5) provides attracting force; the upper end of the magnet (5) is provided with an internal thread which is directly connected with a core shaft thread (12c) of the core shaft (12). The hot pressure device allows the temperature and the applied force to be adjusted, thereby meeting the conditions of multiple times of curing of a high temperature adhesive, and is simple in design, accurate in control and easy to operate.

Description

technical field [0001] The invention relates to the technical field of strain testing, in particular to a hot pressing device for curing high-temperature adhesives. Background technique [0002] During the strain test process, the placement of the strain gauge requires the help of various strain adhesives to stick the strain gauge on the elastic body, so that the strain generated by the elastic body under the action of external load is transmitted to the sensitive grid of the strain gauge, making it produce The resistance changes, and the sensor outputs an electrical signal corresponding to the external force or the displacement of the free end. Therefore, the true degree of adhesive curing and strain transmission is not only related to the performance of the strain gauge itself, but also directly affects the performance of the sensor. [0003] High-temperature strain gauges are mainly used for stress measurement of structures and components in high-temperature environments...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B30B9/00G01B21/32
Inventor 严鲁涛杨志鹏尹涛高飞侯京锋韩澈
Owner TIANJIN AEROSPACE RELIA TECH
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