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LED (Light-Emitting Diode) encapsulation structure and manufacturing method thereof

A manufacturing method and technology for light-emitting diodes, which are applied in electrical components, electrical solid-state devices, circuits, etc., can solve the problems of high manufacturing cost and low reliability, and achieve the advantages of reducing packaging cost, improving reliability and simplifying packaging process. Effect

Active Publication Date: 2013-05-01
SUZHOU ASEN SEMICON CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of this, the present invention provides a light-emitting diode packaging structure to solve the problems of high manufacturing cost and low reliability in the prior art

Method used

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  • LED (Light-Emitting Diode) encapsulation structure and manufacturing method thereof
  • LED (Light-Emitting Diode) encapsulation structure and manufacturing method thereof
  • LED (Light-Emitting Diode) encapsulation structure and manufacturing method thereof

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Embodiment Construction

[0019] The following descriptions of the various embodiments refer to the accompanying drawings to illustrate specific embodiments in which the present invention can be practiced. Furthermore, the directional terms mentioned in the present invention, such as "up", "down", "front", "back", "left", "right", "inside", "outside" or "side", etc., It is only for orientation with reference to the attached drawings. Therefore, the directional terms used are used to illustrate and understand the present invention, but not to limit the present invention.

[0020] figure 1 It is a top view of a light-emitting diode packaging structure according to an embodiment of the present invention, figure 2 and image 3 They are cross-sectional views along the X-X direction and Y-Y direction of the light-emitting diode packaging structure according to an embodiment of the present invention, Figure 4 It is a top view of the carrier of the light-emitting diode packaging structure according to an...

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PUM

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Abstract

The invention discloses an LED (Light-Emitting Diode) encapsulation structure and a manufacturing method thereof. The LED encapsulation structure comprises a bearing piece, an LED chip and a transparent colloid. The bearing piece has at least two pins, at least one of the at least two pins has at least one colloid encapsulating and clamping structure. The LED chip is arranged on the pins of the bearing piece and electrically connected to the pins of the bearing piece. The transparent colloid covers the LED chip and at least one part of bearing piece, is connected with all pins of the bearing piece, and is filled in the colloid encapsulating and clamping structure. Therefore, the manufacturing cost of the LED encapsulation structure can be lowered, the binding strength of the bearing piece and the transparent colloid can be enhanced, and the encapsulating reliability of the products can be improved.

Description

technical field [0001] The present invention relates to a package structure, in particular to a light emitting diode package structure and a manufacturing method thereof. Background technique [0002] As a new type of light source, LED (Light Emitting Diode) has many advantages that traditional light sources cannot match, such as energy saving, environmental protection, long life, and fast start-up speed. In recent years, with the continuous development of light-emitting diode chip technology and packaging technology, more and more light-emitting diodes have been used in the field of lighting and auxiliary lighting. [0003] However, the light-emitting diode packaging structure still has the following problems in actual use, such as: high manufacturing cost, low reliability and other problems. In particular, the carrier parts of the existing light-emitting diode packaging structure are mostly manufactured by pre-sealing, that is, the metal nail frame and the opaque sealing ...

Claims

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Application Information

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IPC IPC(8): H01L33/48H01L33/62
CPCH01L2224/48091
Inventor 包锋崔军项丹汪虞陈乾赵冬冬黄中朋郭桂冠
Owner SUZHOU ASEN SEMICON CO LTD
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