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Multilayer printed circuit board

A multi-layer printing and circuit board technology, applied in the direction of printed circuit components, etc., can solve problems such as insufficient surface area of ​​circuit boards, and achieve the effects of improving work efficiency, reducing production costs, and making production convenient

Inactive Publication Date: 2013-05-01
常州市欧密格电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the insufficient surface area of ​​existing circuit boards, the present invention provides a multilayer printed circuit board

Method used

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  • Multilayer printed circuit board

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Experimental program
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Effect test

Embodiment Construction

[0010] Such as figure 1 It is a structural schematic diagram of the present invention, a multilayer printed circuit board, which includes a first layer of circuit board 1, a second layer of circuit board 2 and a third layer of circuit board 3 laminated in sequence, the first layer of circuit board The lower surface of the board 1 and the second-layer circuit board 2 is provided with a convex portion 4, and the upper surface of the second-layer circuit board 2 and the third-layer circuit board 3 is provided with a concave portion 5, and the convex portion 4 and the concave portion 5 are respectively Mate connection.

[0011] The convex portion 4 and the concave portion 5 are T-shaped. The convex part 4 and the concave part 5 can also be I-shaped or other regular shapes, on the premise of not affecting the work of other components.

[0012] The convex part 4 and the concave part 5 increase the surface area of ​​the circuit board. By increasing the surface area of ​​the multila...

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PUM

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Abstract

The invention relates to the technical field of a printed circuit board, in particular to a multilayer printed circuit board. The circuit board comprises a first layer circuit board, a second layer circuit board and a third layer circuit board, wherein the first layer circuit board, the second layer circuit board and the third layer circuit board are laminated in order; the lower surfaces of the first layer circuit board and the second layer circuit board are provided with a convex part respectively; the upper surfaces of the second layer circuit board and the third layer circuit board are provided with a concave part respectively; and the convex parts and the concave parts are connected respectively in a matching way. Through the increase of the surface area of the multilayer printed circuit board, the available manufacturing completion of more complicated circuits and more elements on the circuit board is guaranteed; the circuit board is simple in structure and convenient to manufacture; and in addition, the working efficiency is improved and the manufacturing cost is decreased.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a multilayer printed circuit board. Background technique [0002] With the wide application of electronic products, circuit boards play an increasingly important role in these products. In order to win the market, manufacturers have made many improvements on circuit boards according to customer needs. However, the current multilayer circuit board has a single form and is made of multilayer circuit boards through processing technology. The components are limited by the surface area of ​​the circuit board, resulting in more complex circuits and components that have to be produced on a large circuit board. Finish. Contents of the invention [0003] In order to overcome the insufficient surface area of ​​existing circuit boards, the invention provides a multilayer printed circuit board. [0004] The technical solution adopted by the present invention to solve the t...

Claims

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Application Information

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IPC IPC(8): H05K1/02
Inventor 陆金发
Owner 常州市欧密格电子科技有限公司