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Semiconductor and high-temperature-resisting antiskid clamp in microelectronic industry

A microelectronics and high-temperature-resistant technology, which is applied in the manufacture of semiconductor/solid-state devices, circuits, electrical components, etc., can solve problems such as scratching the chip, easy air leakage, and pits on the surface of the chip, and achieve the effect of preventing the chip from falling off

Active Publication Date: 2013-05-08
SINO NITRIDE SEMICON +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Tweezers-type clamps have the clamping head and the clamping arm on the same straight line, and the wafer is prone to shaking during the clamping and transferring process, which cannot clamp the wafer well
If the clamping force of the tweezers is increased during the shaking of the wafer, the surface of the wafer may be scratched, the surface layer of the wafer may be damaged, and the glue layer on the surface of the wafer or the surface of the wafer may easily produce pits, such as gallium nitride on the surface of the LED epitaxial wafer. Vulnerable
The second vacuum adsorption method has very high requirements on airtightness, and once the suction cup leaks air, the wafer will fall off
And because the material of the suction cup is rubber, it will be seriously deformed at high temperature, which will easily leak air and pollute the environment
[0006] Defects of existing technical problems: the chuck has no anti-skid function, poor safety, easy to slip; difficult to apply high temperature
Therefore, the above two types of tweezers cannot meet the requirements of safe use in environments with temperatures as high as 800°C.

Method used

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  • Semiconductor and high-temperature-resisting antiskid clamp in microelectronic industry
  • Semiconductor and high-temperature-resisting antiskid clamp in microelectronic industry

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Such as figure 1 As shown, the clamp used in this embodiment has two first clamp arms 1 and second clamp arms 2 that are symmetrical to each other and have the same shape and size. The top ends of the clamp arms are connected by mutual rolling. The clamp arms 2 all have a certain elastic deformation performance. The ends of the first clamp arm 1 and the second clamp arm 2 are connected to the first clamp 3 and the second clamp 4 respectively, and the distance between the ends of the first clamp 3 and the second clamp 4 should be greater than the diameter of wafer 5. The first clamp 3 forms an acute angle with the first clamp arm 1. Similarly, the second clamp arm 2 forms an inward angle with the second clamp 4, and the first clamp 3 and the second clamp 4 form an inward angle. The acute angle can prevent wafer 5 from slipping when clamping like this. Apply force to the first clamp arm 1 and the second clamp arm 2, narrow the distance between the first clamp 3 and the ...

Embodiment 2

[0036] The second kind of embodiment that the present invention designs designs a kind of fixture, as figure 2 As shown, it includes two first clamp arms 1 and second clamp arms 2 that are symmetrical to each other and have the same shape and size. The top ends of the first clamp arm 1 and the second clamp arm 2 are connected together by mutual rolling. The first clamping arm 1 and the second clamping arm 2 have a certain elastic deformation capacity. One chuck 3 is connected to the second chuck 4 , and the distance between the ends of the first chuck 3 and the second chuck 4 is larger than the diameter of the wafer 5 . The difference between this embodiment 2 and the clamp of the first embodiment is that the first clamp 3 and the second clamp 4 of the clamp provided in the present invention are hook-shaped slots with an angle of 90°. The slots of the two chucks face inward, and the wafer 5 is clamped by the slots to effectively prevent the wafer 5 from falling off.

[0037...

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Abstract

The invention discloses a semiconductor and a high-temperature-resisting antiskid clamp in microelectronic industry. Clamp heads and clamp arms are installed in a combined mode. When the clamp is used, the clamp arms are stressed, a to-be-clamped wafer is clamped by clamp grooves, and the wafer is effectively prevented from falling in a clamping process. The antiskid clamp comprises a first clamp arm and a second clamp arm, wherein a first clamp head is installed at the other end of the first clamp arm, a second clamp head is positioned at the other end of the second clamp arm, a clamp groove clamp portion is formed between the first clamp head and the second clamp head, and the first clamp arm and the second clamp arm can control the first clamp head and the second clamp head to act on a sample. The clamp arms and the clamp heads can be made of appropriate high-temperature-resisting materials according to using temperature so as to achieve the purpose of taking and placing the water at high temperature.

Description

technical field [0001] The invention relates to a high-temperature anti-slip jig, in particular to a jig used for clamping wafers in the production process of the semiconductor and microelectronics industries. slide. Background technique [0002] Human beings have fully entered the information society in the 21st century. Microelectronics technology is still developing at a high speed. Higher development requirements will continue to be put forward for microelectronics information technology and microelectronics ULSI basic technology. One of the most important and dynamic high-tech fields. [0003] Fixtures are frequently used and indispensable tools in the production process of microelectronics and semiconductors. [0004] Working in a boring production line for a long time will inevitably make the operator distracted, or use irregular force when clamping the wafer, often causing the wafer to slip or break during the clamping process, which will increase the production c...

Claims

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Application Information

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IPC IPC(8): H01L21/687
Inventor 刘鹏毕绿燕赵红军张国义童玉珍廉宗隅
Owner SINO NITRIDE SEMICON