Method for processing metal-based printed circuit board (PCB) and tin printing jig for processing of metal-based PCB

Abstract

The invention discloses a method for processing a metal-based printed circuit board (PCB) and a tin printing jig for the processing of the metal-based PCB. A metal base and a PCB are correspondingly placed in a metal base groove position and a PCB groove position of the tin printing jig; then solder paste is printed on both the metal base and the PCB; the metal base where the solder paste is printed and the PCB where the solder paste is printed are taken out, the PCB is placed on the metal base in an overlaid mode, and surface mounted elements are mounted on the surface of the PCB through the surface mounting technology (SMT); and lastly, the PCB obtained after the SMT process and the metal base are mounted on a SMT reflow jig for over reflow solder processing to obtain the finished metal-based PCB. Only one over reflow solder process is needed for finishing the welding of the metal base and the PCB and the SMT welding of the PCB and the elements so that production efficiency is improved; and in addition, when one metal-based PCB is processed, no equipment is idle or used for multiple times, and therefore the utilization rate of the equipment is high, and the equipment is suitable for assembly line production.

Description

technical field [0001] The invention relates to the field of printed circuit boards, in particular to a method for processing a metal-based circuit board and a tin printing jig for processing the same. Background technique [0002] Metal-based circuit board is a product used in communication base stations. It is composed of printed circuit board (Printed Circuit Board, PCB), metal base and electronic devices. The metal base can be made of copper, aluminum and other materials. The production process of conventional metal-based products in the industry is roughly as follows figure 1 Shown: First, print lead-free solder paste on one side of the metal base, which uses Sn / Ag / Cu 3C05 solder with a melting point of 217°C, and solder the printed circuit board and the metal base upper fixture together through reflow soldering, and then Take out the soldered printed circuit board sub-products from the jig and clean the flux, and then carry out the normal SMT process on the printed ci...

AI Technical Summary

Problems solved by technology

In this way, although a good soldering effect can be obtained and the separation of the printed circuit board from the metal base due to the remelting of the solder paste during rework is avoided, the production process of such a metal-based circuit board needs to go through two reflow soldering processes. The production efficiency is low; when performing the first reflow soldering, only solder paste and reflow soldering equipment and tools are needed, the placement equipment and tools are idle, and the equipment usage efficiency is low

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