A copper surface treatment process for making thick copper-clad laminates

Abstract

The invention provides a copper surface processing technique for manufacturing a thick copper-clad laminated board. The copper surface processing technique comprises the following steps of: manufacturing the thick copper-clad laminated board manufactured by rolled copper with the thickness which is more than 200 microns; processing the surface of the rolled copper; roughening the clean-up surface of the copper; gluing after the copper is grinded, and drying a gummed copper foil, so as to manufacture gummed copper; and finally, combining the gummed copper with different types of copper-clad boards by using bonding sheets, so as to obtain the thick copper-clad laminated board by hot-pressing. The thick copper-clad laminated board manufactured by the invention has a good bonding property; and the use reliability is greatly improved. Furthermore, compared with a mechanical grinding processing method and a chemical processing method, the copper surface processing technique has the advantages of simple processing process, energy conversation and environmental friendliness; and not only can the requirement on the bonding property of the thick copper-clad laminated board be met, but also the production cost of a product is greatly reduced.

Description

technical field [0001] The invention relates to the technical field of copper clad laminates, in particular to a copper surface treatment process for making thick copper clad laminates. Background technique [0002] Ordinary copper clad laminates generally use electrolytic copper foil with a thickness of less than 105 μm. Electrolytic copper is directly combined with an adhesive sheet, and hot-pressed under a certain temperature and pressure to form a single-sided or double-sided copper clad laminate. With the development of the electronics industry, the printed circuit tends to be high-density, and the copper-clad laminate produced by ordinary electrolytic copper foil is far from meeting the requirements of high-power and high-current lines. Therefore, it is necessary to use thicker copper foil (copper foil thickness greater than 105 μm) to make copper clad laminates to meet this requirement. Electrolytic copper foil can be used to make thick copper laminates with a copper...

AI Technical Summary

Problems solved by technology

Electrolytic copper foil can be used to make thick copper laminates with a copper thickness of less than 200 μm, but when using electrolytic copper foil with a thickness of more than 200 μm to make thick copper laminates, it will face increased production costs (mainly the cost of electrolytic copper) and product flatness Reduced durability, not easy to punch holes and other problems

Images